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Jitter, Noise, and Signal Integrity at High-Speed 1 Book Cased (Hardback)
Jitter, Noise, and Signal Integrity at High-Speed 1 Book Cased (Hardback)

Автор: Mike Li
Название:  Jitter, Noise, and Signal Integrity at High-Speed 1 Book Cased (Hardback)   (Колебание, шум, и целостность сигнала при высокой скорости)
Издательство: Pearson Education
Классификация:
Технический дизайн
Электронная техника
Техника связи / телекоммуникация
Обработка сигнала

ISBN: 0132429616
ISBN-13(EAN): 9780132429610
ISBN: 0-13-242961-6
ISBN-13(EAN): 978-0-13-242961-0
Обложка/Формат: Hardback
Страницы: 400
Вес: 0.891 кг.
Дата издания: 18.12.2007
Язык: ENG
Иллюстрации: Illustrations
Размер: 235 x 178 x 29
Читательская аудитория: Tertiary education (us: college)
Рейтинг:
Поставляется из: США
Описание: Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today`s greatest challenges in high-speed digital design. Now, there`s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee.
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Advanced Signal Integrity for High-Speed Digital Designs

Автор: Hall
Название: Advanced Signal Integrity for High-Speed Digital Designs
ISBN: 0470192356 ISBN-13(EAN): 9780470192351
Издательство: Wiley
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Цена: 11440 р.
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Описание: This book will help contemporary digital designers solve an emerging roadblock to technological progress. Ascomputer technology evolves, new high-speed interconnect phenomena associated with propagating information across the system buses begins to dominate the performance of the platform. This has become a problem because in the past digital designers did not need to understand many of these issues. However, as technology evolves, unforeseen problems arise that dramatically increase the complexity of design. Every new generation of computer design requires the understanding of new issues that were previously not critical, necessitating that engineers continually adapt to meet the latest challenges. In modern and future systems, an incomplete understanding of these high-speed interconnect phenomena will literally result in the progress of digital computing coming to a standstill. The problem is that a good fraction of practicing engineers do not understand these new high-speed signal integrity issues because much of the theory and subsequent design methods have only been developed recently. The strength of the proposed book is that it leverages theory and techniques from non-related fields, such as applied physics, communications and microwave engineering, and applies them to the field of high-speed digital design, creating an optimal combination between theory and practical applications. 

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Semiconductor Modeling: / For Simulating Signal, Power, and Electromagnetic Integrity

Автор: Leventhal Roy G., Green Lynne, Carpenter D.J.
Название: Semiconductor Modeling: / For Simulating Signal, Power, and Electromagnetic Integrity
ISBN: 0387241590 ISBN-13(EAN): 9780387241593
Издательство: Springer
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Цена: 14392 р.
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The Designer`s Guide to Jitter in Ring Oscillators

Автор: John A. McNeill; David Ricketts
Название: The Designer`s Guide to Jitter in Ring Oscillators
ISBN: 0387765263 ISBN-13(EAN): 9780387765266
Издательство: Springer
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Цена: 11513 р.
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Описание: Emphasizes jitter for time domain applications so that there is not a need to translate from frequency domain. This book includes classification of oscillator types. It is suitable for practicing designers with BS or MS degrees and researchers working in fields where noise requirements are specified in the time domain.

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Digital Timing Measurements / From Scopes and Probes to Timing and Jitter

Название: Digital Timing Measurements / From Scopes and Probes to Timing and Jitter
ISBN: 0387314180 ISBN-13(EAN): 9780387314181
Издательство: Springer
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Цена: 12233 р.
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The Designer`s Guide to Jitter in Ring Oscillators

Автор: John A. McNeill; David Ricketts
Название: The Designer`s Guide to Jitter in Ring Oscillators
ISBN: 1441945601 ISBN-13(EAN): 9781441945600
Издательство: Springer
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Цена: 9354 р.
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Описание: This guide emphasizes jitter for time domain applications so that there is not a need to translate from frequency domain. This provides a more direct path to the results for designing in an application area where performance is specified in the time domain.

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Signal Integrity - From High Speed to Radiofrequency Applications

Автор: Ndagijimana
Название: Signal Integrity - From High Speed to Radiofrequency Applications
ISBN: 1848215509 ISBN-13(EAN): 9781848215504
Издательство: Wiley
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Цена: 6908 р.
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Signal Integrity and Radiated Emission of High-Speed Digital Systems

Автор: Caniggia
Название: Signal Integrity and Radiated Emission of High-Speed Digital Systems
ISBN: 0470511664 ISBN-13(EAN): 9780470511664
Издательство: Wiley
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Цена: 8800 р.
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Описание: The aim of the book is to investigate Signal Integrity problems, such as reflections, crosstalk, switching noises and radiated emissions in high-speed digital systems for IT and telecoms applications by using theory, models and many experimental results for practice. Digital devices and their interconnections are modeled by equivalent circuits that allow predictions with commercial SPICE-like circuit simulators. In some cases, especially for radiated emission phenomena and to build models for packaging, results obtained by some commercial full-wave codes are described and discussed. After a short introduction to signaling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modeling techniques.  Since the interconnections, such as traces in PCBs and cables, are very important in system modeling, their fundamental parameters in terms of line inductances and capacitances are defined and methods for their computation are given. Reflections and crosstalk in multi-coupled line structures are investigated by analytical, graphic and circuital methods, and techniques to mitigate these phenomena are provided.

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Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Автор: Li
Название: Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
ISBN: 0470623462 ISBN-13(EAN): 9780470623466
Издательство: Wiley
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Цена: 8976 р.
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Signal Integrity Effects in Custom IC and ASIC Designs

Автор: Raminderpal Singh
Название: Signal Integrity Effects in Custom IC and ASIC Designs
ISBN: 0471150428 ISBN-13(EAN): 9780471150428
Издательство: Wiley
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Цена: 8492 р.
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Описание: Praise for Signal Integrity Effects in Custom IC and ASIC Designs "For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits." --Alina Deutsch, Research Staff Member, T.J. Watson Research Center, International Business Machines "This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip." --Kenneth L. Shepard, Professor, Columbia University "This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." --Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. "This collection of papers...is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection." --Alberto Sangiovanni-Vincentelli, Professor, University of California Berkeley "The editor has gathered together a collection of papers, both tutorial and advanced, that address a broad range of interconnect problems." --Jacob White, Professor, Massachusetts Institute of Technology Signal Integrity Effects in Custom IC and ASIC Designs compiles recent expert research papers in state-of-the-art IC (Integrated Circuits) design. It offers a detailed focus on all the major topics in understanding and modeling real-world IC signal integrity issues for CAD and IC design engineers, as well as graduate engineering students. Practical, in-depth discussion of interconnect effects, inductance effects, power grid and distribution noise, and substrate noise and coupling is included. This specialized coverage provides the knowledge necessary to overcome serious problems in new, more complicated IC designs, such as:Wired and wireless communications ICs Large custom analog mixed-signal ICs ASIC designs from 0.12 microns and above Integrated custom IC blocks in ASIC (Applications-Specific Integrated Circuit) designs

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