Asia as Method: Towards de-Imperialization, Chen Kuan-Hsing, Kuan-Hsing Chen
Автор: Yew Lee Kuan Название: From Third World to First ISBN: 0060957514 ISBN-13(EAN): 9780060957513 Издательство: HarperCollins USA Рейтинг: Цена: 2298.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Few gave tiny Singapore much chance of survival when it was granted independence in 1965. How is it, then, that today the former British colonial trading post is a thriving Asian metropolis with not only the world`s number one airline, but also the world`s fourth-highest per capita real income? This title is the story of that transformation.
Автор: Fairchild Alana Название: Kuan Yin Oracle ISBN: 0987204181 ISBN-13(EAN): 9780987204189 Издательство: DEEP BOOKS Рейтинг: Цена: 3509.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Lem Purchase is in California when a call comes in the dead of night: his younger, disturbed brother in Nebraska announces his plans to carry out an act of terrorism targeting the state capitol building in Lincoln. This isn`t the first time Lem has had to make a frantic check on Jackson. Nor is it the first time that author Robert Vivian has taken us to the haunted world of the Great Plains.
Автор: Chen, Andrea Lo, Randy Hsiao-yu Название: Semiconductor packaging ISBN: 1439862052 ISBN-13(EAN): 9781439862056 Издательство: Taylor&Francis Рейтинг: Цена: 31390.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.
The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.
By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
Автор: Lee Kuan Yew Название: From Third World to First ISBN: 0060197765 ISBN-13(EAN): 9780060197766 Издательство: HarperCollins USA Рейтинг: Цена: 3658.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: An absorbing and in-depth look at Lee Kuan Yew, the man whose singular vision transformed a tiny island into an economically thriving socialist-democratic state that has become the leader of the new Asian economy. This book details his complex economic and social engineering strategies, many of which continue to impact and influence the way business is done, and economies are shaped, all across Asia - and therefore the World - today.
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