Описание: Collects the papers presented during NATO Advanced Research Workshop "Science and technology of Semiconductor on Insulator (SOI) structures and devices operating in a harsh environment". Presenting various innovations in SOI materials and devices, the papers focus on the reliability of SOI structures operating under harsh conditions.
Автор: Torchynska Название: Low-Dimensional Semiconductor Structures ISBN: 1605115940 ISBN-13(EAN): 9781605115948 Издательство: Cambridge Academ Рейтинг: Цена: 15048.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This MRS Proceedings book contains the papers presented in Symposium 7E: `Low-Dimensional Semiconductor Structures` at XXII International Material Research Congress, IMRC 2013, and in Symposium 6B: `Low-Dimensional Semiconductor Structures` at XXI International Material Research Congress, IMRC 2012, which were held in Cancun, Mexico on August 11-15, 2013 and August 12-16, 2012, respectively.
Автор: James Njuguna Название: Lightweight Composite Structures in Transport ISBN: 1782423257 ISBN-13(EAN): 9781782423256 Издательство: Elsevier Science Рейтинг: Цена: 38739.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Lightweight Composite Structures in Transport: Design, Manufacturing, Analysis and Performance provides a detailed review of lightweight composite materials and structures and discusses their use in the transport industry, specifically surface and air transport. The book covers materials selection, the properties and performance of materials, and structures, design solutions, and manufacturing techniques. . A broad range of different material classes is reviewed with emphasis on advanced materials. Chapters in the first two parts of the book consider the lightweight philosophy and current developments in manufacturing techniques for lightweight composite structures in the transport industry, with subsequent chapters in parts three to five discussing structural optimization and analysis, properties, and performance of lightweight composite structures, durability, damage tolerance and structural integrity. Final chapters present case studies on lightweight composite design for transport structures.
Описание: Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits.
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