Chinese Middle Classes: Taiwan, Hong Kong, Macao, and China, Michael Hsiao Hsin-Huang
Автор: Lin Hsiao-ting Название: Accidental State ISBN: 0674659813 ISBN-13(EAN): 9780674659810 Издательство: Wiley Рейтинг: Цена: 6170.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Defeated by Mao Zedong, Chiang Kai-shek`s Nationalists fled to Taiwan to establish a rival state, thereby creating the Two Chinas dilemma that vexes international diplomacy to this day. Hsiao-ting Lin challenges this conventional narrative, showing the many ways the ad hoc creation of this not fully sovereign state was accidental and serendipitous.
Автор: Pai Hsiao Hung Название: Scattered Sand ISBN: 1781680906 ISBN-13(EAN): 9781781680902 Издательство: Неизвестно Рейтинг: Цена: 4407.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Firsthand report on the largest migration in human history
Автор: Chen, Andrea Lo, Randy Hsiao-yu Название: Semiconductor packaging ISBN: 1439862052 ISBN-13(EAN): 9781439862056 Издательство: Taylor&Francis Рейтинг: Цена: 31390.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.
The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.
By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
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