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Chinese Middle Classes: Taiwan, Hong Kong, Macao, and China, Michael Hsiao Hsin-Huang


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Цена: 8573.00р.
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При оформлении заказа до: 2025-07-28
Ориентировочная дата поставки: Август-начало Сентября
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Автор: Michael Hsiao Hsin-Huang
Название:  Chinese Middle Classes: Taiwan, Hong Kong, Macao, and China
ISBN: 9781138120846
Издательство: Taylor&Francis
Классификация:

ISBN-10: 1138120847
Обложка/Формат: Paperback
Страницы: 288
Вес: 0.39 кг.
Дата издания: 04.08.2015
Серия: Routledge contemporary china series
Язык: English
Иллюстрации: 85 tables, black and white; 18 line drawings, black and white; 18 illustrations, black and white
Размер: 234 x 156 x 16
Читательская аудитория: Undergraduate
Ключевые слова: SOCIAL SCIENCE / General,SOCIAL SCIENCE / Ethnic Studies / General
Подзаголовок: Taiwan, hong kong, macao, and china
Ссылка на Издательство: Link
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Поставляется из: Европейский союз
Описание:

The formation and characteristics of a nations middle class are shaped by historical context and the developmental path that has been followed. However, can the same be said of the ethnic Chinese middle classes in Taiwan, China, Hong Kong, and Macao? Given the divergent political and economic experiences under which the respective middle classes were created, established, shaped, and reshaped, can they still be characterized as a homogenous group of Chinese middle classes, or are they more unique within each country?

Using systematic survey data analysis and case studies to examine and compare the emerging middle classes in Taiwan, Hong Kong, Macao and Urban China, this book explores whether the middle classes in these countries possess any uniquely Chinese features, or if these are shared attributes that can be found in other non-Chinese middle classes in the Asia-Pacific region. It analyses the formation, profile, culture, lifestyles, mobility, and politics of the middle class groups in each country, and highlights the differences and similarities that emerge, and focuses in particular on increased mobility, financial resilience, class anxiety, and political interest and effectiveness.

This book will be of great interest to students and scholars interested in Asian middle classes, Chinese studies, Chinese societies, Chinese ethnicity and Chinese politics.




Accidental State

Автор: Lin Hsiao-ting
Название: Accidental State
ISBN: 0674659813 ISBN-13(EAN): 9780674659810
Издательство: Wiley
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Цена: 6170.00 р.
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Описание: Defeated by Mao Zedong, Chiang Kai-shek`s Nationalists fled to Taiwan to establish a rival state, thereby creating the Two Chinas dilemma that vexes international diplomacy to this day. Hsiao-ting Lin challenges this conventional narrative, showing the many ways the ad hoc creation of this not fully sovereign state was accidental and serendipitous.

Scattered Sand

Автор: Pai Hsiao Hung
Название: Scattered Sand
ISBN: 1781680906 ISBN-13(EAN): 9781781680902
Издательство: Неизвестно
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Цена: 4407.00 р.
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Описание: Firsthand report on the largest migration in human history

Semiconductor packaging

Автор: Chen, Andrea Lo, Randy Hsiao-yu
Название: Semiconductor packaging
ISBN: 1439862052 ISBN-13(EAN): 9781439862056
Издательство: Taylor&Francis
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Цена: 31390.00 р.
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Описание:

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.

The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.

By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.


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