New Advances in Mechanisms, Mechanical Transmissions and Robotics, Corves
Автор: David Jin; Sally Lin Название: Advances in Mechanical and Electronic Engineering ISBN: 3642436501 ISBN-13(EAN): 9783642436505 Издательство: Springer Рейтинг: Цена: 30039.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book includes the volume 1 of the proceedings of the 2012 International Conference on Mechanical and Electronic Engineering(ICMEE2012), held at June 23-24,2012 in Hefei, China. This volume 1 is focusing on Mechanical Engineering and Automation as well as Vehicle Engineering and Technology.
Описание: The Second Conference on Mechanisms, Transmissions and Applications - MeTrApp 2013 was organised by the Mechanical Engineering Department of the University of the Basque Country (Spain) under the patronage of the IFToMM Technical Committees Linkages and Mechanical Controls and Micromachines and the Spanish Association of Mechanical Engineering.
Автор: Suryadevara Babu Название: Advances in Chemical Mechanical Planarization (CMP) ISBN: 0081001657 ISBN-13(EAN): 9780081001653 Издательство: Elsevier Science Рейтинг: Цена: 35202.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. . This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. . Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.
Автор: David Jin; Sally Lin Название: Advances in Mechanical and Electronic Engineering ISBN: 364243911X ISBN-13(EAN): 9783642439117 Издательство: Springer Рейтинг: Цена: 30039.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book includes the volume 2 of the proceedings of the 2012 International Conference on Mechanical and Electronic Engineering(ICMEE2012), held at June 23-24,2012 in Hefei, China. This volume 2 is focusing on Mechatronic Engineering and Technology, Electronic Engineering and Electronic Information Technology .
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