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Carbon Nanotubes for Interconnects, Todri-Sanial


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Цена: 16070.00р.
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Наличие: Поставка под заказ.  Есть в наличии на складе поставщика.
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При оформлении заказа до: 2025-07-28
Ориентировочная дата поставки: Август-начало Сентября
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Автор: Todri-Sanial
Название:  Carbon Nanotubes for Interconnects
ISBN: 9783319297446
Издательство: Springer
Классификация:


ISBN-10: 3319297449
Обложка/Формат: Hardback
Страницы: 333
Вес: 0.68 кг.
Дата издания: 2017
Язык: English
Иллюстрации: 34 black & white illustrations, 133 colour illustrations, 16 black & white tables, 133 colour tables, biography
Размер: 234 x 156 x 21
Читательская аудитория: General (us: trade)
Основная тема: Electrical Engineering
Подзаголовок: Process, Design and Applications
Ссылка на Издательство: Link
Рейтинг:
Поставляется из: Германии
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Дополнительное описание: Interconnect challenges for 2D and 3D Integration.- Overview of Carbon Nanotube Physical Properties.- Overview of Carbon Nanotube Processing Methods.- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization.- Computational Studies of T



Optical Interconnects for Data Centers

Автор: Tekin, Tolga
Название: Optical Interconnects for Data Centers
ISBN: 0081005121 ISBN-13(EAN): 9780081005125
Издательство: Elsevier Science
Рейтинг:
Цена: 31686.00 р.
Наличие на складе: Поставка под заказ.

Описание: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. . Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.

Variation Tolerant On-Chip Interconnects

Автор: Ethiopia Enideg Nigussie
Название: Variation Tolerant On-Chip Interconnects
ISBN: 1489990860 ISBN-13(EAN): 9781489990860
Издательство: Springer
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Цена: 18167.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. It is for anyone concerned with the design of next generation, high-performance electronics systems.


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