Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing, Liu

Автор: Iyengar Madhusudan Et Al
Название: Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
ISBN: 9814579785 ISBN-13(EAN): 9789814579780
Издательство: World Scientific Publishing
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Цена: 23760.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание:

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.

This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Автор: Maurizio Di Paolo Emilio
Название: Microelectronic Circuit Design for Energy Harvesting Systems
ISBN: 331947586X ISBN-13(EAN): 9783319475868
Издательство: Springer
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Цена: 16769.00 р.
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Описание: This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design.