Microelectronics Packaging Handbook, R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf

Автор: John Lau
Название: Thermal Stress and Strain in Microelectronics Packaging
ISBN: 1468477692 ISBN-13(EAN): 9781468477696
Издательство: Springer
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Цена: 16979.00 р.
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Описание: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.

Автор: Serge Luryi
Название: Future Trends in Microelectronics: The Nano Millennium
ISBN: 0471212474 ISBN-13(EAN): 9780471212478
Издательство: Wiley
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Цена: 15384.00 р.
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Описание: Nanotechnology has been named by the US government as one of the most important areas of forthcoming technology. This book presents contributions from a number of leading professionals in the semiconductor microelectronics industry debating the future evolution of their profession.

Автор: J. Greer
Название: Nano and Giga Challenges in Microelectronics,
ISBN: 0444514945 ISBN-13(EAN): 9780444514943
Издательство: Elsevier Science
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Цена: 16843.00 р.
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Описание: Gives an introduction for engineers and researchers wishing to obtain a fundamental knowledge of the edge in technology research. This book also acts as an essential reference for the "gurus" wishing to keep abreast of the directions and challenges in microelectronic technology development and future trends.