Описание: Transistor-level design for complex mixed-signal systems-on-chip remains difficult to automate. This book shows how a modified genetic algorithm kernel can improve efficiency in the analog IC design cycle and includes a worked example of the method.
Описание: These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential.
Автор: Swaminathan Madhavan Название: Design and Modeling for 3D ICs and Interposers ISBN: 9814508594 ISBN-13(EAN): 9789814508599 Издательство: World Scientific Publishing Рейтинг: Цена: 16790.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Описание: Transistor-level design for complex mixed-signal systems-on-chip remains difficult to automate. This book shows how a modified genetic algorithm kernel can improve efficiency in the analog IC design cycle and includes a worked example of the method.
Описание: SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling.
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