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Solder Joint Reliability Assessment, Mohd N. Tamin; Norhashimah M. Shaffiar


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Автор: Mohd N. Tamin; Norhashimah M. Shaffiar
Название:  Solder Joint Reliability Assessment
ISBN: 9783319000916
Издательство: Springer
Классификация:



ISBN-10: 3319000918
Обложка/Формат: Hardcover
Страницы: 174
Вес: 0.43 кг.
Дата издания: 13.05.2014
Серия: Advanced Structured Materials
Язык: English
Издание: 2014 ed.
Иллюстрации: 55 illustrations, color; 64 illustrations, black and white; xiii, 174 p. 119 illus., 55 illus. in color.
Размер: 244 x 160 x 15
Читательская аудитория: Professional & vocational
Основная тема: Characterization and Evaluation of Materials
Подзаголовок: Finite Element Simulation Methodology
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.


A Guide to Lead-free Solders / Physical Metallurgy and Reliability

Автор: Evans John W., Kwon Dong-il, Engelmaier Werner
Название: A Guide to Lead-free Solders / Physical Metallurgy and Reliability
ISBN: 1846283094 ISBN-13(EAN): 9781846283093
Издательство: Springer
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Цена: 17462.00 р.
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Описание: The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.

Lead-Free Electronic Solders / A Special Issue of the Journal of Materials Science: Materials in Electronics

Автор: Subramanian K.N.
Название: Lead-Free Electronic Solders / A Special Issue of the Journal of Materials Science: Materials in Electronics
ISBN: 0387484310 ISBN-13(EAN): 9780387484310
Издательство: Springer
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Цена: 30606.00 р.
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Описание: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. It collects the work of researchers recognized for their significant scientific contributions in the area.

Reliability Data Collection and Use in Risk and Availability Assessment

Автор: Viviana Colombari; Tema SpA
Название: Reliability Data Collection and Use in Risk and Availability Assessment
ISBN: 3642837239 ISBN-13(EAN): 9783642837234
Издательство: Springer
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Цена: 16979.00 р.
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Описание: International cooperation on reliability and accident data collection and processing, exchange of experience on actual uses of data and reliability engineering techniques is a major step in realising safer and more efficient industrial systems. This book provides an updated presentation of the activities in this field on a worldwide basis.

OSS Reliability Measurement and Assessment

Автор: Shigeru Yamada; Yoshinobu Tamura
Название: OSS Reliability Measurement and Assessment
ISBN: 3319318179 ISBN-13(EAN): 9783319318172
Издательство: Springer
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Цена: 16979.00 р.
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Описание:

Software Reliability.- NHPP Model and AHP for OSS Reliability Analysis.- NHPP Model and ANP for OSS Reliability Analysis.- Stochastic Differential Equation Models for OSS Reliability Analysis.- Hazard Rates for Embedded OSS Reliability Analysis.- Reliability Analysis for Open Source Solution.

Reliability-Centered Maintenance,

Автор: John Moubray
Название: Reliability-Centered Maintenance,
ISBN: 0750633581 ISBN-13(EAN): 9780750633581
Издательство: Elsevier Science
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Цена: 9599.00 р.
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Описание: This text gives a practical explanation of what reliability-centred maintenance is and how it is efectively applied. The plant-based approach of the book makes it well-suited for use in industrial training schemes and centres of higher technical education.

Numerical Methods for Reliability and Safety Assessment

Название: Numerical Methods for Reliability and Safety Assessment
ISBN: 3319071661 ISBN-13(EAN): 9783319071664
Издательство: Springer
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Цена: 6986.00 р.
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Reliability Data Collection and Use in Risk and Availability Assessment

Автор: Tema SpA; Hans-J?rg Wingender
Название: Reliability Data Collection and Use in Risk and Availability Assessment
ISBN: 3642827756 ISBN-13(EAN): 9783642827754
Издательство: Springer
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Цена: 22203.00 р.
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Описание: Reliability data collection and its use in risk and availability assessment is a subject of increasing importance. Although the first and principle interest of EuReDatA is reliability data and data banks, the Association is aware that these are tools that are used with others to establish and maintain reliability and safety.

Systems Reliability Assessment

Автор: A.G. Colombo; Amalio Saiz de Bustamante
Название: Systems Reliability Assessment
ISBN: 9401067775 ISBN-13(EAN): 9789401067775
Издательство: Springer
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Цена: 16979.00 р.
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Описание: Proceedings of the Ispra Course held at the Escuela Tecnica Superior de Ingenieros Navales, Madrid, Spain, September 19-23, 1988 in collaboration with Universidad Politecnica de Madrid


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