Wafer-Level Chip-Scale Packaging, Shichun Qu; Yong Liu

Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif
Название: Wafer Level 3-D ICs Process Technology
ISBN: 1441945628 ISBN-13(EAN): 9781441945624
Издательство: Springer
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Цена: 26120.00 р.
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Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.

Автор: Liu S
Название: Led packaging for lighting application
ISBN: 0470827831 ISBN-13(EAN): 9780470827833
Издательство: Wiley
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Цена: 17416.00 р.
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Описание: Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials.