CHIPS 2020 VOL. 2, Bernd H?fflinger

Название: 3d stacked chips
ISBN: 3319204807 ISBN-13(EAN): 9783319204802
Издательство: Springer
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Цена: 16979.00 р.
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Описание: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

Автор: Srinivasan Murali
Название: Designing Reliable and Efficient Networks on Chips
ISBN: 904818200X ISBN-13(EAN): 9789048182008
Издательство: Springer
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Цена: 19589.00 р.
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Описание: The book provides state-of-the-art methods to solve some of the most important problems encountered during NoC design. It is the first book to present in depth the state-of-the-art algorithms and optimization models for performing system-level design of NoCs.

Автор: Platt Charles
Название: Encyclopedia of Electronic Components Volume 2: Diodes, Transistors, Chips, Light, Heat, and Sound Emitters
ISBN: 1449334180 ISBN-13(EAN): 9781449334185
Издательство: Wiley
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Цена: 3800.00 р.
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Описание: Want to know how to use an electronic component? This second book of a three-volume set includes key information on electronics parts for your projects - complete with photographs, schematics, and diagrams. You`ll learn what each one does, how it works, why it`s useful, and what variants exist.