Nanoscale Magnetic Materials and Applications, J. Ping Liu; Eric Fullerton; Oliver Gutfleisch; D.
Автор: Anatoli Korkin; David J. Lockwood Название: Nanoscale Applications for Information and Energy Systems ISBN: 1493942131 ISBN-13(EAN): 9781493942138 Издательство: Springer Рейтинг: Цена: 16977.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents nanotechnology fundamentals and applications in the key research areas of information technology and solar energy: plasmonics, photovoltaics, transparent conducting electrodes, silicon electroplating, and resistive switching.
Автор: Yosi Shacham-Diamand; Tetsuya Osaka; Madhav Datta; Название: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ISBN: 1461497442 ISBN-13(EAN): 9781461497448 Издательство: Springer Рейтинг: Цена: 32004.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application.
Автор: Y. Watanabe; S. Heun; G. Salviati; N. Yamamoto Название: Nanoscale Spectroscopy and Its Applications to Semiconductor Research ISBN: 3662143720 ISBN-13(EAN): 9783662143728 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Fisher Timothy S Название: Thermal Energy at the Nanoscale ISBN: 9814449784 ISBN-13(EAN): 9789814449786 Издательство: World Scientific Publishing Рейтинг: Цена: 5069.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: These lecture notes provide a detailed treatment of the thermal energy storage and transport by conduction in natural and fabricated structures. Thermal energy in two carriers, i.e. phonons and electrons -- are explored from first principles. For solid-state transport, a common Landauer framework is used for heat flow. Issues including the quantum of thermal conductance, ballistic interface resistance, and carrier scattering are elucidated. Bulk material properties, such as thermal and electrical conductivity, are derived from particle transport theories, and the effects of spatial confinement on these properties are established.
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