Design of Adhesive Joints Under Humid Conditions, Lucas F. M. da Silva; Chiaki Sato

Автор: Lucas F. M. da Silva; Chiaki Sato
Название: Design of Adhesive Joints Under Humid Conditions
ISBN: 3642376134 ISBN-13(EAN): 9783642376139
Издательство: Springer
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Цена: 16979.00 р.
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Описание: This book describes advances and limitations concerning the design of adhesive joints under humid conditions. It presents approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time.

Автор: Lucas F. M. da Silva
Название: Modeling of Adhesively Bonded Joints
ISBN: 3642097898 ISBN-13(EAN): 9783642097898
Издательство: Springer
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Цена: 20896.00 р.
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Описание: The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.

Автор: Dillard David, Dillard D., Dillard Da
Название: Advances in Structural Adhesive Bonding
ISBN: 0081014465 ISBN-13(EAN): 9780081014462
Издательство: Elsevier Science
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Цена: 31160.00 р.
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Описание: Adhesive bonding is often effective, efficient, and often necessary way to join mechanical structures. This important book reviews the most recent improvements in adhesive bonding and their wide-ranging potential in structural engineering.Part one reviews advances in the most commonly used groups of structural adhesives with chapters covering topics such as epoxy, polyurethane, silicone, cyanoacrylate, and acrylic adhesives. The second set of chapters covers the various types of adherends and pre-treatment methods for a range of structural materials such as metals, composites and plastics. Chapters in Part three analyse methods and techniques with topics on joint design, life prediction, fracture mechanics and testing. The final group of chapters gives useful and practical insights into the problems and solutions of adhesive bonding in a variety of hostile environments such as chemical, wet and extreme temperatures.With its distinguished editor and international team of contributors, Advances in structural adhesive bonding is a standard reference for structural and chemical engineers in industry and the academic sector.

Автор: Jonas O. Wolff; Stanislav N. Gorb
Название: Attachment Structures and Adhesive Secretions in Arachnids
ISBN: 3319457128 ISBN-13(EAN): 9783319457123
Издательство: Springer
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Цена: 22359.00 р.
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Описание: This book surveys attachment structures and adhesive secretions occurring in this class of animals and discusses the relationships between structure, properties, and function in the context of evolutionary trends, and biomimetic potential. Topics comprise mechanical attachment devices, such as clamps, claws, hooks, spines and wraps, as well as hairy and smooth adhesive pads, nano-fibrils, suction cups, and viscid and solidifying adhesives. Attachment is one of the major types of interactions between an organism and its environment. There are numerous studies that deal with this phenomenon in lizards, frogs, insects, barnacles, mussels and echinoderms, but the second largest class of animals, the Arachnida, was highly neglected so far. The authors demonstrated that most arachnid adhesive structures are highly analogous to those of insects and vertebrates, but there are also numerous unique developments with some intriguing working principles. Because arachnid attachment organs have a very strong potential of technological ideas for the development of new materials and systems, inspirations from biology could also be interesting for a broad range of topics in materials and surface engineering.

Автор: Lieng-Huang Lee
Название: Adhesive Chemistry
ISBN: 1461294819 ISBN-13(EAN): 9781461294818
Издательство: Springer
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Цена: 16979.00 р.
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Описание: Proceedings of a Symposium on Recent Developments in Adhesive Chemistry, sponsored by the Divsion of Organic Coatings and Plastics Chemistry of the American Chemical Society, held March 21-23, 1983, in Seattle, Washington

Автор: J.H. Sadek
Название: Industrial Applications of Adhesive Bonding
ISBN: 9401080291 ISBN-13(EAN): 9789401080293
Издательство: Springer
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Цена: 14365.00 р.
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Описание: Recently, considerable research effort has been devoted to the fabrication of structures by adhesive bonding due to its definite advantages compared with other conventional techniques such as casting and welding.

Автор: L.H. Lee
Название: Adhesive Bonding
ISBN: 1475790082 ISBN-13(EAN): 9781475790085
Издательство: Springer
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Цена: 26122.00 р.
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Описание: For several years, I have been responsible for organizing and teaching in the fall a short course on "Fundamentals of Adhesion: Theory, Practice, and Applications" at the State University of New York at New Paltz.

Автор: Jing Yu
Название: Adhesive Interactions of Mussel Foot Proteins
ISBN: 3319060309 ISBN-13(EAN): 9783319060309
Издательство: Springer
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Цена: 18167.00 р.
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Описание: The results in this thesis show that Dopa plays an essential role in mussel adhesion and that mussels delicately control the interfacial redox environment to achieve strong and durable Dopa mediated adhesion.

Автор: Jing Yu
Название: Adhesive Interactions of Mussel Foot Proteins
ISBN: 331938340X ISBN-13(EAN): 9783319383408
Издательство: Springer
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Цена: 13059.00 р.
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Описание: The results in this thesis show that Dopa plays an essential role in mussel adhesion and that mussels delicately control the interfacial redox environment to achieve strong and durable Dopa mediated adhesion.

Автор: L.H. Lee
Название: Adhesive Bonding
ISBN: 0306434717 ISBN-13(EAN): 9780306434716
Издательство: Springer
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Цена: 26122.00 р.
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Описание: For several years, I have been responsible for organizing and teaching in the fall a short course on "Fundamentals of Adhesion: Theory, Practice, and Applications" at the State University of New York at New Paltz.

Автор: D. Satas
Название: Handbook of Pressure Sensitive Adhesive Technology
ISBN: 1475708688 ISBN-13(EAN): 9781475708684
Издательство: Springer
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Цена: 22359.00 р.
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