Molecular Modeling and Multiscaling Issues for Electronic Material Applications, Artur Wymyslowski; Nancy Iwamoto; Matthew Yuen; Ha
Автор: Garner, Sean M., Название: Flexible Glass ISBN: 1118946367 ISBN-13(EAN): 9781118946367 Издательство: Wiley Рейтинг: Цена: 31038.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Provides the reader how to apply flexible glass applications that are not possible or practical to address with alternative substrate materials. Examples of technology areas include displays, touch sensors, lighting, backplanes, and photovoltaics.
Built on more than 10 years of valuable discussions and collaborations focused on truly defining what flexible glass means in the context of the emerging electronic and opto-electronic applications, this book provides a broad overview as well as detailed descriptions that cover flexible glass properties, device fabrication methods, and emerging applications. It provides the basis for identifying new device designs, applications, and manufacturing processes for which flexible glass substrates are uniquely suited and encourages and enables the reader to identify and pursue advanced flexible glass applications that do not exist today and provides a launching point for exciting future directions.
The chapters are grouped into three sections. The first focuses on flexible glass and flexible glass reliability and has three chapters with authors from Corning. The second section focuses on flexible glass device fabrication which includes chapters on roll-to-roll processing, vacuum deposition, and printed electronics. These chapters are authored by established experts in their respective fields that have extensive experience in processing flexible glass substrates in toolsets that range from research to pilot scale. The third section focuses on flexible glass device applications and includes chapters on photovoltaics, displays, integrated photonics, and microelectronics integration. These are authored by experts with direct experience in fabricating and characterizing flexible glass devices. The diverse list of authors and their depth of experience in working with a variety of material systems, processes, and device technologies significantly adds valuable context to the overall flexible glass discussion.
Описание: This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field.
Описание: This book shows how molecular modeling is used to understand materials and solve relevant problems. Coverage includes attempts to reach the atomistic and submicron scales, the relationship between structures and mechanical performance of materials.
Автор: Fish Jacob Название: Practical Multiscaling ISBN: 1118410688 ISBN-13(EAN): 9781118410684 Издательство: Wiley Рейтинг: Цена: 15357.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Practical Multiscaling covers fundamental modelling techniques aimed at bridging diverse temporal and spatial scales ranging from the atomic level to a full-scale product level. It focuses on practical multiscale methods that account for fine-scale (material) details but do not require their precise resolution.
Автор: Weinberger Название: Multiscale Materials Modeling for Nanomechanics ISBN: 3319334786 ISBN-13(EAN): 9783319334783 Издательство: Springer Рейтинг: Цена: 17468.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents a unique combination of chapters that togetherprovide a practical introduction to multiscale modeling applied to nanoscalematerials mechanics. The goal of this book is to present a balancedtreatment of both the theory of the methodology, as well as some practicalaspects of conducting the simulations and models. The first half of thebook covers some fundamental modeling and simulation techniques ranging from ab-inito methods to the continuum scale.Included in this set of methods are several different concurrent multiscalemethods for bridging time and length scales applicable to mechanics at the nanoscaleregime. The second half of the book presents a range of casestudies from a varied selection of research groups focusing either on a the applicationof multiscale modeling to a specific nanomaterial, or novel analysis techniquesaimed at exploring nanomechanics. Readers are also directed tohelpful sites and other resources throughout the book where the simulationcodes and methodologies discussed herein can be accessed. Emphasis on thepracticality of the detailed techniques is especially felt in the latter halfof the book, which is dedicated to specific examples to studynanomechanics and multiscale materials behavior. An instructive avenue forlearning how to effectively apply these simulation tools to solve nanomechanicsproblems is to study previous endeavors. Therefore, each chapter iswritten by a unique team of experts who have used multiscale materials modelingto solve a practical nanomechanics problem. These chapters provide an extensivepicture of the multiscale materials landscape from problem statement throughthe final results and outlook, providing readers with a roadmap forincorporating these techniques into their own research.
Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Описание: This volume provides expert coverage of the state-of-the-art in sol-gel materials for functional applications in energy, environment and electronics.
ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
