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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films, Y. Sungtaek Ju; Kenneth E. Goodson


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Автор: Y. Sungtaek Ju; Kenneth E. Goodson
Название:  Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
ISBN: 9780792385912
Издательство: Springer
Классификация:

ISBN-10: 0792385918
Обложка/Формат: Hardcover
Страницы: 102
Вес: 0.36 кг.
Дата издания: 31.08.1999
Серия: Microsystems
Язык: English
Размер: 234 x 156 x 10
Основная тема: Engineering
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: Discusses experimental and theoretical studies of heat transfer in transistors and interconnects. This book reports techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers.


Microscale Heat Conduction in Integrated Circuits and Their Constituent Films

Автор: Y. Sungtaek Ju; Kenneth E. Goodson
Название: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
ISBN: 1461373743 ISBN-13(EAN): 9781461373742
Издательство: Springer
Рейтинг:
Цена: 13974.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Electronic Conduction in Oxides

Автор: N. Tsuda; K. Nasu; A. Fujimori; K. Siratori
Название: Electronic Conduction in Oxides
ISBN: 3642086276 ISBN-13(EAN): 9783642086274
Издательство: Springer
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Цена: 26120.00 р.
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Описание: This is a revised version of the first edition published in 1991. At the same time, this is a revised version of the Syokabo edition, which was written in Japanese and published in 1993 as a revised version of the original edition published in 1983. Compared with the first edition, the following revisions have been made: a new chapter on electron-electron interaction has been prepared by a new co-author A. Fujimori. The substances in the previous Chap. 4 have been changed, and La-xSrxMn03 substituted for V 0, which has been exten- 1 2 3 sively reviewed in Reviews of Modern Physics, Vol. 70, p. 1039 (1998) by M. Imada, A. Fujimori and Y. Tokura. Section 4.6, NiO, was rewritten by A. Fujimori. The other chapters have also been revised by each author to ac- commodate new developments which have appeared since the publication of the first edition. As a result, the references have been increased from 1088 to 1293, and 83 figures are new or improved. The authors are: N. Tsuda for Chaps. 1, 2 and Sects. 5.1-5.5 and 5.9, K. Nasu for Chap. 2, A. Fujimori for Chap. 3 and Sects. 5.6 and 5.7, and K. Siratori for Sect. 5.8. The authors would like to express their gratitude to many authors and publishers for allowing them to reproduce their diagrams, and to H.K.V. Latsch and C.E. Ascheron for their encouragement to complete this book.

Microscale Diagnostic Techniques

Автор: Kenny Breuer
Название: Microscale Diagnostic Techniques
ISBN: 3642062024 ISBN-13(EAN): 9783642062025
Издательство: Springer
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Цена: 18284.00 р.
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Описание: Microscale Diagnostic Techniques highlights the most innovative and powerful developments in microscale diagnostics.

Microscale Soft Robotics

Автор: Kim
Название: Microscale Soft Robotics
ISBN: 3319502859 ISBN-13(EAN): 9783319502854
Издательство: Springer
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Цена: 7685.00 р.
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Описание: This book presents the technological basics and applications of small-scale (mm to sub-mm in length-scales) soft robots and devices, written for researchers in both academia and industry. Author Jaeyoun Kim presents technological motivations, enabling factors, and examples in an inter-linked fashion, making it easy for readers to understand and explore how microscale soft robots are a solution to researchers in search of technological platforms for safe, human-friendly biomedical devices. A compact and timely introduction, this book summarizes not only the enabling factors for soft robots and MEMS devices, but also provides a survey of progress in the field and looks to the future in terms of the material, design, and application aspects this technology demonstrates.


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