Silicon Devices and Process Integration, Badih El-Kareh
Автор: Yin, Ruiyu Название: Theory and Methods of Metallurgical Process Integration ISBN: 0128095687 ISBN-13(EAN): 9780128095683 Издательство: Elsevier Science Рейтинг: Цена: 23244.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Theory and Methods of Metallurgical Process Integration analyzes the basic elements and characteristics of steel manufacturing processes and operation, also proposing a theory of precise dynamic design and integration of steel plants. Following several case studies, a new generation steel manufacturing process is proposed.
Through deep description and analysis of the dynamic operation of the steel manufacturing process, this book can help readers understand that the study of dynamic integration for the "mass-energy-time-space-information" during the steel manufacturing process has to be highly emphasized in order to further promote optimization of the steel manufacturing process and plant.
Extends the research methodology and future direction of the metallurgical process
Concentrates on the study of the physical essence and the running rules of the dynamic operation of the steel manufacturing process
Summarizes six rules for the dynamic operation of the steel manufacturing process for newly-built or existing steel plants, which provides useful guidance for engineering design, production technology, and production and technology management
Автор: Garrou P Название: Handbook of 3D Integration V 3 ISBN: 3527334661 ISBN-13(EAN): 9783527334667 Издательство: Wiley Рейтинг: Цена: 22643.00 р. Наличие на складе: Поставка под заказ.
Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.
Автор: Darabi Название: Integration of Passive RF Front End Components in SoCs ISBN: 0521111269 ISBN-13(EAN): 9780521111263 Издательство: Cambridge Academ Рейтинг: Цена: 14096.00 р. Наличие на складе: Поставка под заказ.
Описание: Examining key developments in highly integrated wireless RF front ends, this book describes problems with the use of surface acoustic wave (SAW) filters, evaluates alternative solutions for on-chip high-Q filtering, and presents M-phase filters in depth. This is core reading for practitioners and researchers in RF integrated circuit design.
Автор: Baliga B Jayant Название: Gallium Nitride And Silicon Carbide Power Devices ISBN: 9813109408 ISBN-13(EAN): 9789813109407 Издательство: World Scientific Publishing Рейтинг: Цена: 16790.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
"This is a very well written book with many illustrations, examples, and references that will give the reader a good understanding of the concepts being explained. This will surely become a classic reference book on power semiconductors. Students in the power semiconductor field as well as working professionals in the field that want to quickly learn about wide bandgap power semiconductors will find this book to be invaluable and well worth the time to read."
IEEE Electrical Insulation Magazine
During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental demonstration of their enhanced performances for power electronic systems. Gallium nitride power devices made by the growth of the material on silicon substrates have gained a lot of interest. Power device products made from these materials have become available during the last five years from many companies.
This comprehensive book discusses the physics of operation and design of gallium nitride and silicon carbide power devices. It can be used as a reference by practicing engineers in the power electronics industry and as a textbook for a power device or power electronics course in universities.
Автор: Lars Rebohle; Wolfgang Skorupa Название: Rare-Earth Implanted MOS Devices for Silicon Photonics ISBN: 3642265588 ISBN-13(EAN): 9783642265587 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book concentrates on the microstructural, electric and optoelectronic properties of rare-earth implanted MOS structures and their use as light emitters in potential applications.
Автор: Badih El-Kareh; R.J. Bombard Название: Introduction to VLSI Silicon Devices ISBN: 1461294045 ISBN-13(EAN): 9781461294047 Издательство: Springer Рейтинг: Цена: 25853.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The illustrations may prove to be of great help to "newcomers" when dealing with the characterization of real devices and relating the measured data to device physics and process parameters.
Автор: Lau John Название: Through-Silicon Vias for 3D Integration ISBN: 0071785140 ISBN-13(EAN): 9780071785143 Издательство: McGraw-Hill Рейтинг: Цена: 27626.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
Автор: Francis E. H. Tay Название: Materials & Process Integration for MEMS ISBN: 1402071752 ISBN-13(EAN): 9781402071751 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Offers the background, tools, and directions you need to confidently choose fabrication methods and materials for miniaturization problems (materials, processes, designs, characterisations and potential applications). This title is suitable for academics and professionals who are active in the field of MEMS.
Автор: Francis E. H. Tay Название: Materials & Process Integration for MEMS ISBN: 1441953035 ISBN-13(EAN): 9781441953032 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures.
Описание: Silicon technology is evolving rapidly, particularly in board-to-board or chip-to chip applications. This book describes the merging of photonics and electronics in silicon and other group IV elements. It presents the challenges, the limitations, and the upcoming possibilities of these developments.
Автор: Garrou Philip Название: Handbook of 3d Integration V1 and 2 ISBN: 3527332650 ISBN-13(EAN): 9783527332656 Издательство: Wiley Рейтинг: Цена: 23118.00 р. Наличие на складе: Поставка под заказ.
Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.
Автор: Badih El-Kareh; R.J. Bombard Название: Introduction to VLSI Silicon Devices ISBN: 0898382106 ISBN-13(EAN): 9780898382105 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The illustrations may prove to be of great help to "newcomers" when dealing with the characterization of real devices and relating the measured data to device physics and process parameters.
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