Handbook Of Electronics Packaging Design and Engineering, Bernard S. Matisoff
Автор: Bernard S. Matisoff Название: Handbook Of Electronics Packaging Design and Engineering ISBN: 9401169810 ISBN-13(EAN): 9789401169813 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design.
Автор: Togneri Название: Fundamentals of Information Theory and Coding Design ISBN: 1584883103 ISBN-13(EAN): 9781584883104 Издательство: Taylor&Francis Рейтинг: Цена: 19140.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Presents working algorithms and implementations that can be used to design and create real systems. This book emphasises on the underlying concepts governing information theory and the mathematical basis for modern coding systems. It also provides the practical details of important codes like Reed-Solomon, BCH, and Turbo codes.
Описание: The book is a collection of academic papers from a conference that focuses on significant issues, fundamental and applied research advances on a range of topics in the areas of textile engineering, apparel, fashion and design. education and training in textile and apparel and design, fashion, footwear product and materials innovation.
Автор: Roy Название: Surface Engineering for Enhanced Wear Performance ISBN: 370910100X ISBN-13(EAN): 9783709101001 Издательство: Springer Рейтинг: Цена: 23508.00 р. Наличие на складе: Поставка под заказ.
Описание: Surface Engineering for Tribological Applications covers processes by experts in the field. The text presents tribological performances for each process, as well as in-depth studies of diffusion coatings, nanocomposite films for wear resistance, and more.
Описание: Over the past decades, fault diagnosis (FDI) and fault tolerant control strategies (FTC) have been proposed based on different techniques for linear and nonlinear systems. Indeed a considerable attention is deployed in order to cope with diverse damages resulting in faults occurrence.
Автор: Borja Название: Dielectric Breakdown in Gigascale Electronics ISBN: 3319432184 ISBN-13(EAN): 9783319432182 Издательство: Springer Рейтинг: Цена: 7836.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.
Автор: Ankur Singh; Akhilesh K. Gaharwar Название: Microscale Technologies for Cell Engineering ISBN: 3319207253 ISBN-13(EAN): 9783319207254 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book offers readers cutting-edge research at the interface of polymer science and engineering, biomedical engineering, materials science, and biology. State-of-the-art developments in microscale technologies for cell engineering applications are covered, including technologies relevant to both pluripotent and adult stem cells, the immune system, and somatic cells of the animal and human origin. This book bridges the gap in the understanding of engineering biology at multiple length scale, including microenvironmental control, bioprocessing, and tissue engineering in the areas of cardiac, cartilage, skeletal, and vascular tissues, among others. This book also discusses unique, emerging areas of micropatterning and three-dimensional printing models of cellular engineering, and contributes to the better understanding of the role of biophysical factors in determining the cell fate. Microscale Technologies for Cell Engineering is valuable for bioengineers, biomaterial scientists, tissue engineers, clinicians, immunoengineers, immunologists and stem cell biologists, as it offers a review of the current cutting-edge cell engineering research at multiple length scale and will be valuable in developing new strategies for efficient scale-up and clinical translation.
Описание: Over the past decades, fault diagnosis (FDI) and fault tolerant control strategies (FTC) have been proposed based on different techniques for linear and nonlinear systems. Indeed a considerable attention is deployed in order to cope with diverse damages resulting in faults occurrence.
Описание: Nanoscale CMOS Materials and Devices.- Beyond CMOS Materials, Devices and Their Diagnostic.- New Functional Nanomaterials and Nanoscaled Devices for Energy Harvesting, Light Emission, Optoelectronics and THz Range.- NanoSensors and MEMS/NEMS.
Автор: Davim J. Paulo, Paulo Davim J. Название: Mechatronics and Manufacturing Engineering: Research and Development ISBN: 0081016549 ISBN-13(EAN): 9780081016541 Издательство: Elsevier Science Рейтинг: Цена: 24844.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book, the first in the Woodhead Publishing Reviews: Mechanical Engineering Series, is a collection of high quality articles (full research articles, review articles and cases studies) with a special emphasis on research and development in mechatronics and manufacturing engineering. Mechatronics is the blending of mechanical, electronic, and computer engineering into an integrated design. Today, mechatronics has a significant and increasing impact on engineering with emphasis on the design, development and operation of manufacturing engineering systems. The main objective of this interdisciplinary engineering field is the study of automata from an engineering perspective, thinking on the design of products and manufacturing processes and systems. Mechatronics and manufacturing systems are well established and executed within a great number of industries including aircraft, automotive and aerospace industries; machine tools, moulds and dies product manufacturing, computers, electronics, semiconductor and communications, and biomedical.
Автор: James E. Morris Название: Electronics Packaging Forum ISBN: 9401092885 ISBN-13(EAN): 9789401092883 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly.
Автор: James E. Morris Название: Electronics Packaging Forum ISBN: 9401066817 ISBN-13(EAN): 9789401066815 Издательство: Springer Рейтинг: Цена: 12157.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru
