Thermal Conductivity 17, J. G. Hust

Автор: P. Klemens
Название: Thermal Conductivity 14
ISBN: 1489937536 ISBN-13(EAN): 9781489937537
Издательство: Springer
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Автор: J.R., Jr. Thomas; D.P.H. Hasselman
Название: Thermal Conductivity 20
ISBN: 1461280699 ISBN-13(EAN): 9781461280699
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Описание: The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa- tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.

Автор: V. V. Mirkovich
Название: Thermal Conductivity 15
ISBN: 146159085X ISBN-13(EAN): 9781461590859
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Описание: I am sure the time has come when Con- ference Chairmen in coming years will be soliciting contributions not only in the physical sciences and engineering`, but will actively seek contributions from the earth sciences and life sciences as well.

Автор: Y.K. Godovsky, V.P. Privalko, D.M. Bigg
Название: Thermal and Electrical Conductivity of Polymer Materials (Advances in Polymer Science)
ISBN: 366214865X ISBN-13(EAN): 9783662148655
Издательство: Springer
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Автор: T. Ashworth; David R. Smith
Название: Thermal Conductivity 18
ISBN: 1468449184 ISBN-13(EAN): 9781468449181
Издательство: Springer
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Описание: The Conferences were held annu- ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.

Автор: David C. Larsen
Название: Thermal Conductivity 16
ISBN: 1468442678 ISBN-13(EAN): 9781468442670
Издательство: Springer
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Описание: From 1961 to 1973 the Confer- ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon- sor of the Conferences.

Автор: Subhash L. Shinde; Jitendra Goela
Название: High Thermal Conductivity Materials
ISBN: 1441919562 ISBN-13(EAN): 9781441919564
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Описание: Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth's atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm, and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate "hot spots" completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as "heat spreaders." The high thermal conductivity of these materials allows the heat to be carried away from the "hot spots" very quickly in all directions thereby "spreading" the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.