Progress in Adhesion and Adhesives, Volume 3, Mittal

Автор: Anthony J. Kinloch
Название: Adhesion and Adhesives
ISBN: 904814003X ISBN-13(EAN): 9789048140039
Издательство: Springer
Рейтинг:
Цена: 28732.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Over the last decade, or so, the growth in the use of adhesives, especially in ever more technically demanding applications, has been rapid and many major developments in the technology of adhesives have been reported. This growth has also led to attention being focused on somewhat more basic studies of the science of adhesion and adhesives, and in recent years our level of fundamental knowledge concerning the formation and mechanical performance of adhesive joints has increased dramatically. Such studies have, of course, been aided greatly by the development of the tools at the disposal of the investigators. For example, specific surface analytical techniques, such as X-ray photoelectron and secondary-ion mass spectroscopy, and the increasingly sophisticated methods of stress analysis and fracture mechanics have been put to good use in furthering our understanding of the science of adhesion and adhesives. The present book attempts to review the multidisciplined subject of adhesion and adhesives, considering both the science and technology involved in the formation and mechanical performance of adhesive joints. The author would like to thank his friends and colleagues for useful discus- sions and help in the preparation of this book. I am particularly grateful to P. Cawley, J. Comyn, W. A. Lees, A. C. Roulin-Moloney, W. C. Wake, J. G. Williams and R. J. Young who have read and commented on various chapters and P. Farr for preparing the diagrams.

Автор: Alam M. O., Bailey C., Bailey Christopher
Название: Advanced Adhesives in Electronics: Materials, Properties and Applications
ISBN: 0081017324 ISBN-13(EAN): 9780081017326
Издательство: Elsevier Science
Рейтинг:
Цена: 23580.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Автор: Irving Skeist
Название: Handbook of Adhesives
ISBN: 1461280192 ISBN-13(EAN): 9781461280194
Издательство: Springer
Рейтинг:
Цена: 16979.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Автор: Wong, C. P. Li, Yi Lu, Daniel
Название: Electrical conductive adhesives with nanotechnologies
ISBN: 0387887822 ISBN-13(EAN): 9780387887821
Издательство: Springer
Рейтинг:
Цена: 22203.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Offers an overview of electronic packaging, and discusses the various adhesives options, including lead-free solder and Electrically Conductive Adhesives. This title discusses how nano techniques can be applied to conductive adhesives, including research and development of nano component adhesives/nano component films.