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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices, Lian-Tuu Yeh


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Автор: Lian-Tuu Yeh
Название:  Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices
ISBN: 9780791861097
Издательство: Mare Nostrum (Eurospan)
Классификация:
ISBN-10: 0791861090
Обложка/Формат: Hardcover
Страницы: 500
Вес: 0.87 кг.
Дата издания: 30.07.2016
Серия: Electronic packaging
Язык: English
Издание: 2 revised edition
Иллюстрации: Black & white illustrations
Размер: 229 x 152 x 29
Читательская аудитория: Professional and scholarly
Ключевые слова: Electronics engineering
Подзаголовок: Heat transfer theory, analysis methods, and design practices
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Поставляется из: Англии
Описание: This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.


Thermal Design of Liquid Cooled Microelectronic Equipment

Автор: Yeh Lian-Tuu
Название: Thermal Design of Liquid Cooled Microelectronic Equipment
ISBN: 0791861937 ISBN-13(EAN): 9780791861936
Издательство: Mare Nostrum (Eurospan)
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Цена: 20097.00 р.
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Описание: Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.

Microelectronic Circuit Design for Energy Harvesting Systems

Автор: Maurizio Di Paolo Emilio
Название: Microelectronic Circuit Design for Energy Harvesting Systems
ISBN: 331947586X ISBN-13(EAN): 9783319475868
Издательство: Springer
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Цена: 16769.00 р.
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Описание: This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design.

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Автор: Iyengar Madhusudan Et Al
Название: Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
ISBN: 9814579785 ISBN-13(EAN): 9789814579780
Издательство: World Scientific Publishing
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Цена: 23760.00 р.
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Описание:

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.

This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Structural Analysis in Microelectronic and Fiber-Optic Systems

Автор: Ephraim Suhir
Название: Structural Analysis in Microelectronic and Fiber-Optic Systems
ISBN: 9401165378 ISBN-13(EAN): 9789401165372
Издательство: Springer
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Цена: 6986.00 р.
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Описание: This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in high technology engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc- tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc- tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi- ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.

MEMS: A Practical Guide of Design, Analysis, and Applications

Автор: Jan Korvink; Oliver Paul
Название: MEMS: A Practical Guide of Design, Analysis, and Applications
ISBN: 3662568357 ISBN-13(EAN): 9783662568354
Издательство: Springer
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Цена: 27950.00 р.
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Описание: A new generation of MEMS books has emerged with this cohesive guide on the design and analysis of micro-electro-mechanical systems (MEMS). Satisfying a demand for literature on analysis and design of microsystems the book deals with a broad array of industrial applications.


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