Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies, Arjuna Marzuki, Ahmad Ismat Abdul Rahim, Mourad Loulou
Описание: Enabling Technologies for the Internet of Things: Wireless Circuits, Systems and Networks collects slides and notes from the lectures given in the 2017 Seasonal School Enabling Technologies for the Internet-of-Things, supported by IEEE CAS Society and by INTEL funding, and organized by Prof. Sergio Saponara, and Prof. Giuliano Manara.The book discusses new trends in Internet-of-Things (IoT) technologies, considering technological and training aspects, with special focus on electronic and electromagnetic circuits and systems. IoT involves research and design activities both in analog and in digital circuit/signal domains, including focus on sensors interfacing and conditioning, energy harvesting, low-power signal processing, wireless connectivity and networking, functional safety (FuSa). FuSa is one of the emerging key issues in IoT applications in safety critical domain like industry 4.0, autonomous and connected vehicles and e-health. Our world is becoming more and more interconnected. Currently it is estimated that two hundred billion smart objects will be part of the IoT by 2020. This new scenario will pave the way to innovative business models and will bring new experiences in everyday life. The challenge is offering products, services and comprehensive solutions for the IoT, from technology to intelligent and connected objects and devices to connectivity and data centers, enhancing smart home, smart factory, autonomous driving cars and much more, while at the same time ensuring the highest safety standards. In safety-critical contexts, where a fault could jeopardize the human life, safety becomes a key aspect.
Автор: Yu Hao & Tan Chuan Seng Название: Advances In 3D Integrated Circuits And Systems ISBN: 9814699004 ISBN-13(EAN): 9789814699006 Издательство: World Scientific Publishing Цена: 19800.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
Автор: Yu Hao & Tan Chuan Seng Название: Advances In 3D Integrated Circuits And Systems ISBN: 9814699012 ISBN-13(EAN): 9789814699013 Издательство: World Scientific Publishing Рейтинг: Цена: 7603.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Автор: Andrzej Napieralski; Zygmunt Ciota; Augustin Marti Название: Mixed Design of Integrated Circuits and Systems ISBN: 146137586X ISBN-13(EAN): 9781461375869 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Very fast advances in IC technologies have brought new challenges into the physical design of integrated systems.
Описание: Provides models, methodologies and tools to support each step of the co-design flow of embedded systems implemented by exploiting heterogeneous multi-processor architectures mapped on distributed systems, as well as fully integrated onto a single chip.
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