Описание: In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation.
Автор: Veendrick Название: Bits on Chips ISBN: 3319760955 ISBN-13(EAN): 9783319760957 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application.
Автор: Harry Veendrick Название: Bits on Chips ISBN: 3030094014 ISBN-13(EAN): 9783030094010 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of the semiconductor disciplines who want to broaden their semiconductor horizon.
Название: 3d stacked chips ISBN: 3319204807 ISBN-13(EAN): 9783319204802 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
Описание: This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.
Автор: V. K., Mathew Название: Hybrid Genetic Optimization for IC Chips Thermal Control ISBN: 1032033533 ISBN-13(EAN): 9781032033532 Издательство: Taylor&Francis Рейтинг: Цена: 24499.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Froehlich Название: Post 2030-Agenda and the Role of Space ISBN: 3319789538 ISBN-13(EAN): 9783319789538 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a deep insight to which extent further improvement should be envisaged to ensure and improve the sustainable development beyond 2030 (the Sustainable Development Goals is a set of 17 global goals with 169 associated targets which the state community adopted in 2015). As the world, its environment, economy and society is getting more and more technical advanced, it is of high interest to analyze how space and its various applications can support this development. Once the Goals of the “2030 Agenda for Sustainable Development” will be achieved new challenges are waiting. The analysis takes into account a proactive use of artificial intelligence for the development based on space infrastructure. Another important aspect revolves around the economic development which asks for further analysis of the cryptocurrencies relationship with space applications and how to use space based cryptocurrencies for development. Environment-wise the challenges for a sustainable development on Earth i.e. water supply, but also in outer space are requested ensuring a sustainable exploration and exploitation of space and its orbital resources. The book also highlights possible contributions of the post-2030 space industry to global economic development based on satellite technology and the enlargement of the scope of application of satellite data in administration and Justice to ensure development of effective, accountable and transparent institutions at all levels to promote growth, stability and security and peace on global level.
Автор: Srinivasan Murali Название: Designing Reliable and Efficient Networks on Chips ISBN: 904818200X ISBN-13(EAN): 9789048182008 Издательство: Springer Рейтинг: Цена: 19589.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book provides state-of-the-art methods to solve some of the most important problems encountered during NoC design. It is the first book to present in depth the state-of-the-art algorithms and optimization models for performing system-level design of NoCs.
Автор: Bernd H?fflinger Название: CHIPS 2020 VOL. 2 ISBN: 3319366092 ISBN-13(EAN): 9783319366098 Издательство: Springer Рейтинг: Цена: 9794.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore`s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance.
Автор: Bernd Hoefflinger Название: Chips 2020 ISBN: 3662506459 ISBN-13(EAN): 9783662506455 Издательство: Springer Рейтинг: Цена: 11753.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Chips 2020 presents a new, sustainable roadmap towards femto(10-15)-Joule low-energy, high-performance electronics. The text focuses on the energy-efficiency of all chip functionalities, sensing, processing, and communication.
Автор: ?kos Zar?ndy Название: Focal-Plane Sensor-Processor Chips ISBN: 1489994688 ISBN-13(EAN): 9781489994684 Издательство: Springer Рейтинг: Цена: 18284.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Focal-Plane Sensor-Processor Chips explores both the implementation and application of state-of-the-art vision chips. Presenting an overview of focal plane chip technology, the text discusses smart imagers and cellular wave computers, along with numerous examples of current vision chips.
Описание: This very detailed book discusses architectures, circuits and procedures for the optimum design of bandpass sigma-delta A/D interfaces for mixed-signal chips in standard CMOS technologies. It provides uniquely in-depth coverage of switched-current errors, which supports the design of high performance SI chips.
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