Описание: This thesis demonstrates the adaptation of existing techniques and principles towards enabling clean and precise measurements of biomolecules interacting with inorganic surfaces. In particular, it includes real-time measurement of serum proteins interacting with engineered nanomaterial. Making meaningful and unambiguous measurements has been an evolving problem in the field of biology and its various allied domains, primarily due to the complex nature of experiments and the large number of possible interferants. The subsequent quantification of interactions between biomolecules and inorganic surfaces solves pressing problems in the rapidly developing fields of lipidomics and nanomedicine.
Автор: Qua, Hock-chye Tan, Ching-seong Wong, Kok-cheong Ho, Jee-hou Wang, Xin Yap, Eng-hwa Ooi, Jong-boon Wong, Yee-shiuan Название: Applied engineering failure analysis ISBN: 1482222183 ISBN-13(EAN): 9781482222180 Издательство: Taylor&Francis Рейтинг: Цена: 31390.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Applied Engineering Failure Analysis: Theory and Practice provides a point of reference for engineering failure analysis (EFA) cases, presenting a compilation of case studies covering a 35-year period, from the 1970s to 2012. This period spans the era from the time when slide rules were used routinely for engineering calculations, and when hard-copy photographs taken by film cameras were pasted onto typewritten sheets to make reports, to the present time when all these functions have become much less onerous through computer assistance.
The cases are drawn from such diverse fields as mechanical engineering, metallurgy, mining, civil/structural engineering, electrical power systems, and radiation damage; the last two topics are quite scarce in current publications. It includes theoretical content that deals with useful topics in basic theory, material properties, failure mechanisms, EFA methodology, and applications. It provides high-quality illustrations throughout, which greatly helps to promote the understanding of the failure characteristics described. This book offers an integrated approach that serves as a useful first reference in the above topics, for undergraduate and postgraduate students, as well as for practicing engineers.
The book provides a hands-on approach to EFA, which helps the user to develop an understanding of potential failure situations, to explore the consequences, and to better understand how to solve similar problems; it also helps users to develop their own techniques for most other engineering failure problems. The authors include a section on technical report writing, which will assist failure investigators in getting their findings across. They also present simple engineering calculations that may serve as illustrative examples, and typical problems and solutions are included at the end of each chapter.
Автор: Ian Kuon; Jonathan Rose Название: Quantifying and Exploring the Gap Between FPGAs and ASICs ISBN: 1489985093 ISBN-13(EAN): 9781489985095 Издательство: Springer Рейтинг: Цена: 18167.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The differences between FPGA and ASIC technologies are examined in this reference, with a particular focus on cost, performance and power consumption. Common misconceptions between the two devices are addressed and specific design choices are highlighted.
Описание: This thesis demonstrates the adaptation of existing techniques and principles towards enabling clean and precise measurements of biomolecules interacting with inorganic surfaces.
Автор: Sahrling, Mikael, Название: Fast techniques for integrated circuit design / ISBN: 1108498450 ISBN-13(EAN): 9781108498456 Издательство: Cambridge Academ Рейтинг: Цена: 15365.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Learn how to use estimation techniques to solve integrated circuit (IC) design problems, accelerate the design process, and enhance understanding of complex systems with this step-by-step guide. Using numerous real-world application examples, it is ideal for both early-career and established professionals and researchers, and graduate students, working in IC design.
Описание: The International Conference on Fracture Mechanics Technology Applied to Material Evaluation and Structure Design was held in Melbourne, Australia, from August 10 to 13, 1982. Particular emphases were placed on applying the fracture mechanics tech- nology for assessing interactions between material properties, design and opera- tional requirements.
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