This volume contains a collection of 22 papers submitted from the below seven symposia held during the 11th International Symposium on Ceramic Materials and Components for Energy and Environmental Applications (CMCEE-11), June 14-19, 2015 in Vancouver, BC, Canada:
Additive Manufacturing Technologies
Advanced Materials, Technologies, and Devices for Electro-optical and Biomedical Applications
Multifunctional Coatings for Energy and Environmental Applications
Novel, Green, and Strategic Processing and Manufacturing Technologies
Powder Processing Technology for Advanced Ceramics
Computational Design and Modeling
Materials for Extreme Environments: Ultra-high Temperature Ceramics (UHTCs) and Nanolaminated Ternary Carbides and Nitrides (MAX Phases)
Автор: Gi-Chul Yang; Sio-Iong Ao; Len Gelman Название: Transactions on Engineering Technologies ISBN: 9402403930 ISBN-13(EAN): 9789402403930 Издательство: Springer Рейтинг: Цена: 30039.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume contains fifty-one revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, UK, 2-4 July, 2014), under the World Congress on Engineering 2014 (WCE 2014).
Описание: These proceedings capture advances in the state of knowledge in nuclear and waste materials science and technology. In addition, the proceedings addresses the environmental issues associated with ceramic processing. Included are the status of environmental issues and their solutions, both current and proposed. .
Описание: In today`s world of increasingly stringent environmental regulations, it is critical to identify and adequately address environmental issues in the ceramic industry to ensure success. In addition, ceramics and glasses play a critical role in the nuclear industry.
Описание: Compiles a number of papers presented at the 9th International Conference on Ceramic Materials and Components for Energy and Environmental Applications (9 th CMCEE) in Shanghai, China and was the continuation of a series of international conferences held all over the world over the last three decades.
Автор: Gi-Chul Yang; Sio-Iong Ao; Len Gelman Название: Transactions on Engineering Technologies ISBN: 9401788316 ISBN-13(EAN): 9789401788311 Издательство: Springer Рейтинг: Цена: 43100.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications.
Автор: Gi-Chul Yang; Sio-Iong Ao; Len Gelman Название: Transactions on Engineering Technologies ISBN: 9401798036 ISBN-13(EAN): 9789401798037 Издательство: Springer Рейтинг: Цена: 39182.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume contains fifty-one revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, UK, 2-4 July, 2014), under the World Congress on Engineering 2014 (WCE 2014).
Автор: Gi-Chul Yang; Sio-Iong Ao; Len Gelman Название: Transactions on Engineering Technologies ISBN: 9402403140 ISBN-13(EAN): 9789402403145 Издательство: Springer Рейтинг: Цена: 36570.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications.
Автор: Gi-Chul Yang; Sio-Iong Ao; Xu Huang; Oscar Castill Название: Transactions on Engineering Technologies ISBN: 9402402209 ISBN-13(EAN): 9789402402209 Издательство: Springer Рейтинг: Цена: 22201.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume contains revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science was held in Hong Kong, 13-15 March, 2013.
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