ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020),
Описание: Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Описание: A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.
Описание: Presents 56 papers covering topics including Industrial and Cogeneration, Manufacturing Materials and Metallurgy, Marine, Microturbines, and Turbochargers, and Small Turbomachines.
Описание: Presents eight papers covering topics including Design With and Failure Analyses of Polymer, Composite, Additive Manufactured, and Meta Materials.