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Hybrid Assemblies and Multichip Modules, Kear, Fred W.


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Цена: 24499.00р.
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Автор: Kear, Fred W.
Название:  Hybrid Assemblies and Multichip Modules
ISBN: 9780824784669
Издательство: Taylor&Francis
Классификация:


ISBN-10: 0824784669
Обложка/Формат: Hardback
Страницы: 296
Вес: 0.64 кг.
Дата издания: 16.12.1992
Серия: Manufacturing engineering and materials processing
Язык: English
Размер: 234 x 163 x 25
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Поставляется из: Европейский союз


Assemblies of Gold Nanoparticles at Liquid-Liquid Interfaces

Автор: Evgeny Smirnov
Название: Assemblies of Gold Nanoparticles at Liquid-Liquid Interfaces
ISBN: 3030085724 ISBN-13(EAN): 9783030085728
Издательство: Springer
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Цена: 19564.00 р.
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Описание: This book is devoted to various aspects of self-assembly of gold nanoparticles at liquid-liquid interfaces and investigation of their properties. It covers primarily two large fields: (i) self-assembly of nanoparticles and optical properties of these assemblies; and (ii) the role of nanoparticles in redox electrocatalysis at liquid-liquid interfaces. The first part aroused from a long-lasting idea to manipulate adsorption of nanoparticles at liquid-liquid with an external electric field to form 'smart' mirrors and/or filters. Therefore, Chapters 3 to 5 are dedicated to explore fundamental aspects of charged nanoparticles self-assembly and to investigate optical properties (extinction and reflectance) in a through manner. Novel tetrathiafulvalene (TTF)-assisted method leads to self-assembly of nanoparticles into cm-scale nanofilms or, so-called, metal liquid-like droplets (MeLLDs) with remarkable optical properties. The second part (Chapters 6 to 8) clarifies the role of nanoparticles in interfacial electron transfer reactions. They demonstrate how nanoparticles are charged and discharged upon equilibration of Fermi levels with redox couples in solution and how it can be used to perform HER and ORR. Finally, Chapter 9 gives a perspective outlook, including applications of suggested methods in fast, one-step preparation of colloidosomes, SERS substrates as well as pioneer studies on so-called Marangony-type shutters drive by the electric field.

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Автор: John W. Balde
Название: Foldable Flex and Thinned Silicon Multichip Packaging Technology
ISBN: 146134977X ISBN-13(EAN): 9781461349778
Издательство: Springer
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Цена: 20962.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

Molecular Magnetism: From Molecular Assemblies to the Devices

Автор: E. Coronado; Pierre Delha?s; D. Gatteschi; Joel S.
Название: Molecular Magnetism: From Molecular Assemblies to the Devices
ISBN: 9048147247 ISBN-13(EAN): 9789048147243
Издательство: Springer
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Цена: 54504.00 р.
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Описание: Proceedings of the NATO Advanced Study Institute on `Localized and Itinerant Molecular Magnetism: From Molecular Assemblies to the Devices`, Puerto de la Cruz, Tenerife, Spain, April 23-May 3, 1995

Supramolecular Assemblies Based on Electrostatic Interactions

Автор: Aboudzadeh
Название: Supramolecular Assemblies Based on Electrostatic Interactions
ISBN: 3031006569 ISBN-13(EAN): 9783031006562
Издательство: Springer
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Цена: 16769.00 р.
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Описание: This volume presents recent advances and current knowledge in the field of supramolecular assemblies based on electrostatic interactions. The flexibility and simplicity of constructing assemblies is explained via several examples, illustrations, figures, case studies, and historical perspectives. Moreover, as there is an increasing demand for the use of theoretical and computational models of the interaction strengths for assisting with the experimental studies, one chapter specifically focuses on the "modelling'' of supramolecular assemblies. Finally, various aspects of the recent advances of the field as well as potential future opportunities are discussed, with the goal being to stimulate critical discussions among the community and to encourage further discovery. This volume aims to inspire and guide fellow scientists and students working in this field and thus it provides a great tool for all researchers, graduates and professionals specializing on the topic.

Well-Organized Inorganic Nanowire Films: Assemblies and Functionalities

Автор: Liu Jian-Wei
Название: Well-Organized Inorganic Nanowire Films: Assemblies and Functionalities
ISBN: 9811350078 ISBN-13(EAN): 9789811350078
Издательство: Springer
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Цена: 13974.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This thesis presents the latest findings on macroscopic-scale nanowire thin films composed of integrated nanowires. The book highlights examples specific to well-aligned nanowire systems, and explores the applications of nanowire systems, including memory devices, flexible transparent electrodes, etc.

Ultrafast Dynamics at the Nanoscale

Автор: Haacke, Stefan
Название: Ultrafast Dynamics at the Nanoscale
ISBN: 9814745332 ISBN-13(EAN): 9789814745338
Издательство: Taylor&Francis
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Цена: 18374.00 р.
Наличие на складе: Нет в наличии.

Magnetic Nanoparticle Assemblies

Название: Magnetic Nanoparticle Assemblies
ISBN: 9814411965 ISBN-13(EAN): 9789814411967
Издательство: Taylor&Francis
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Цена: 17609.00 р.
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Описание: Magnetic nanoparticles with diameters in the range of a few nanometers are today at the cutting edge of modern technology and innovation because of their use in numerous applications ranging from engineering to biomedicine. A great deal of scientific interest has been focused on the functionalization of magnetic nanoparticle assemblies. The understanding of interparticle interactions is necessary to clarify the physics of these assemblies and their use in the development of high-performance magnetic materials.This book reviews prominent research studies on the static and dynamic magnetic properties of nanoparticle assemblies, gathering together experimental and computational techniques in an effort to reveal their optimized magnetic properties for biomedical use and as ultra-high magnetic recording media.

Assemblies of Gold Nanoparticles at Liquid-Liquid Interfaces

Автор: Smirnov
Название: Assemblies of Gold Nanoparticles at Liquid-Liquid Interfaces
ISBN: 3319779133 ISBN-13(EAN): 9783319779133
Издательство: Springer
Рейтинг:
Цена: 19564.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This Thesis is devoted to various aspects of self-assembly of gold nanoparticles at liquid-liquid interfaces and investigation of their properties. Therefore, Chapters 3 to 5 are dedicated to explore fundamental aspects of charged nanoparticles self-assembly and to investigate optical properties (extinction and reflectance) in a through manner.

Bacteriophage Tail Fibers as a Basis for Structured Assemblies

Автор: Hyman Paul, Harrah Timothy
Название: Bacteriophage Tail Fibers as a Basis for Structured Assemblies
ISBN: 079186037X ISBN-13(EAN): 9780791860373
Издательство: Неизвестно
Цена: 18612.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Well-Organized Inorganic Nanowire Films

Автор: Jian-Wei Liu
Название: Well-Organized Inorganic Nanowire Films
ISBN: 9811039461 ISBN-13(EAN): 9789811039461
Издательство: Springer
Рейтинг:
Цена: 15372.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This thesis presents the latest findings on macroscopic-scale nanowire thin films composed of integrated nanowires. The book highlights examples specific to well-aligned nanowire systems, and explores the applications of nanowire systems, including memory devices, flexible transparent electrodes, etc.

Photonic Packaging Sourcebook

Автор: Ulrich H. P. Fischer-Hirchert
Название: Photonic Packaging Sourcebook
ISBN: 3662521350 ISBN-13(EAN): 9783662521359
Издательство: Springer
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Цена: 15672.00 р.
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Описание: Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.

Multichip Modules with Integrated Sensors

Автор: W.K. Jones; G?bor Hars?nyi
Название: Multichip Modules with Integrated Sensors
ISBN: 9401066310 ISBN-13(EAN): 9789401066310
Издательство: Springer
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Цена: 18167.00 р.
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Описание: Proceedings of the NATO Advanced Research Workshop, Budapest, Hungary, May 18-20, 1995


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