Carbon Materials for Advanced Technologies,, T.D. Burchell
Автор: N. Eswara Prasad; R. J. H. Wanhill Название: Aerospace Materials and Material Technologies ISBN: 9811021333 ISBN-13(EAN): 9789811021336 Издательство: Springer Рейтинг: Цена: 25155.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book is a comprehensive compilation of chapters on materials (both established and evolving) and material technologies that are important for aerospace systems. It considers aerospace materials in three Parts. Part I covers Metallic Materials (Mg, Al, Al-Li, Ti, aero steels, Ni, intermetallics, bronzes and Nb alloys); Part II deals with Composites (GLARE, PMCs, CMCs and Carbon based CMCs); and Part III considers Special Materials. This compilation has ensured that no important aerospace material system is ignored. Emphasis is laid in each chapter on the underlying scientific principles as well as basic and fundamental mechanisms leading to processing, characterization, property evaluation and applications. This book will be useful to students, researchers and professionals working in the domain of aerospace materials.
Автор: M. A. Meyers Название: Nano and Microstructural Design of Advanced Materials, ISBN: 0080443737 ISBN-13(EAN): 9780080443737 Издательство: Elsevier Science Рейтинг: Цена: 29476.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Advanced characterization and fabrication methods are enabling scientists to build structures atom-by-atom or molecule-by molecule. This title focuses on the effective use of such advanced analysis and characterization techniques in the design of materials. It contains examples of materials in which such design concepts have been applied.
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.
The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
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