Handbook of 3d Integration V1 and 2, Garrou Philip
Автор: Darabi Название: Integration of Passive RF Front End Components in SoCs ISBN: 0521111269 ISBN-13(EAN): 9780521111263 Издательство: Cambridge Academ Рейтинг: Цена: 14096.00 р. Наличие на складе: Поставка под заказ.
Описание: Examining key developments in highly integrated wireless RF front ends, this book describes problems with the use of surface acoustic wave (SAW) filters, evaluates alternative solutions for on-chip high-Q filtering, and presents M-phase filters in depth. This is core reading for practitioners and researchers in RF integrated circuit design.
Описание: Silicon technology is evolving rapidly, particularly in board-to-board or chip-to chip applications. This book describes the merging of photonics and electronics in silicon and other group IV elements. It presents the challenges, the limitations, and the upcoming possibilities of these developments.
Автор: Lau John Название: 3D IC Integration and Packaging ISBN: 0071848061 ISBN-13(EAN): 9780071848060 Издательство: McGraw-Hill Рейтинг: Цена: 33632.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
Описание: This handbook brings together a comprehensive collection of mathematical material in one location. It also offers a variety of new results interpreted in a form that is particularly useful to engineers, scientists, and applied mathematicians.
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