3D IC Integration and Packaging, Lau John

Автор: Darabi
Название: Integration of Passive RF Front End Components in SoCs
ISBN: 0521111269 ISBN-13(EAN): 9780521111263
Издательство: Cambridge Academ
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Цена: 14096.00 р.
Наличие на складе: Поставка под заказ.

Описание: Examining key developments in highly integrated wireless RF front ends, this book describes problems with the use of surface acoustic wave (SAW) filters, evaluates alternative solutions for on-chip high-Q filtering, and presents M-phase filters in depth. This is core reading for practitioners and researchers in RF integrated circuit design.

Автор: Garrou Philip
Название: Handbook of 3d Integration V1 and 2
ISBN: 3527332650 ISBN-13(EAN): 9783527332656
Издательство: Wiley
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Цена: 23118.00 р.
Наличие на складе: Поставка под заказ.

Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.

Автор: Garrou P
Название: Handbook of 3D Integration V 3
ISBN: 3527334661 ISBN-13(EAN): 9783527334667
Издательство: Wiley
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Цена: 22643.00 р.
Наличие на складе: Поставка под заказ.

Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.