Carbon Nanotube Electronics, Ali Javey; Jing Kong

Автор: Wei Fan; Longsheng Zhang; Tianxi Liu
Название: Graphene-Carbon Nanotube Hybrids for Energy and Environmental Applications
ISBN: 9811028028 ISBN-13(EAN): 9789811028021
Издательство: Springer
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Цена: 7685.00 р.
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Описание: This book describes various carbon nanomaterials and their unique properties, and offers a detailed introduction to graphene-carbon nanotube (CNT) hybrids. Further, it discusses the preparation, structures and properties of graphene-CNT hybrids, providing interesting examples of three types of graphene-CNT hybrids with different nanostructures.

Автор: Grimes
Название: Tio2 nanotube arrays
ISBN: 1441900675 ISBN-13(EAN): 9781441900678
Издательство: Springer
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Цена: 26122.00 р.
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Описание: Vertically oriented, highly ordered TiO2 nanotube arrays are unique and easily fabricated materials with an architecture that demonstrates remarkable charge transfer as well as photocatalytic properties. This book includes an introduction to TiO2 nanotubes, as well as a description of the materials properties and synthesis of research.

Автор: Ferreira
Название: Functionalizing Graphene and Carbon Nanotubes
ISBN: 3319351095 ISBN-13(EAN): 9783319351094
Издательство: Springer
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Цена: 7836.00 р.
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Описание: This book compiles all current information on the different types of functionalization of carbon nanotubes (CNTs) and graphene, both covalent and non-covalent. The book starts with a general overview of the synthesis, characterization and application of functionalized CNTs and graphene. Special attention is dedicated to the characterization of functionalized materials, a topic rarely addressed on the literature. The authors provide a comparison between the functionalization of these two types of carbon materials.

Автор: Todri-Sanial
Название: Carbon Nanotubes for Interconnects
ISBN: 3319297449 ISBN-13(EAN): 9783319297446
Издательство: Springer
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Цена: 16070.00 р.
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Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.