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Advanced Materials for Thermal Management of Electronic Packaging, Xingcun Colin Tong Ph.D


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Цена: 23508.00р.
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При оформлении заказа до: 2025-07-28
Ориентировочная дата поставки: Август-начало Сентября
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Автор: Xingcun Colin Tong Ph.D
Название:  Advanced Materials for Thermal Management of Electronic Packaging
ISBN: 9781461427926
Издательство: Springer
Классификация:




ISBN-10: 1461427924
Обложка/Формат: Paperback
Страницы: 550
Вес: 0.97 кг.
Дата издания: 2011
Серия: Springer Series in Advanced Microelectronics
Язык: English
Иллюстрации: 26 black & white tables, biography
Размер: 243 x 236 x 31
Читательская аудитория: Professional & vocational
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.


Ion Beam Processes in Advanced Electronic Materials and Device Technology

Автор: Appleton
Название: Ion Beam Processes in Advanced Electronic Materials and Device Technology
ISBN: 1107405688 ISBN-13(EAN): 9781107405684
Издательство: Cambridge Academ
Цена: 4277.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials for Advanced Packaging

Автор: Daniel Lu; C.P. Wong
Название: Materials for Advanced Packaging
ISBN: 3319450972 ISBN-13(EAN): 9783319450971
Издательство: Springer
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Цена: 32142.00 р.
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Описание: This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.

Theory of Charge Transport in Carbon Electronic Materials

Автор: Shuai
Название: Theory of Charge Transport in Carbon Electronic Materials
ISBN: 3642250750 ISBN-13(EAN): 9783642250750
Издательство: Springer
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Цена: 7182.00 р.
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Описание: Mechanism of charge transport in organic solids has been an issue of intensive interests and debates for over 50 years, not only because of the applications in printing electronics, but also because of the great challenges in understanding the electronic processes in complex systems. With the fast developments of both electronic structure theory and the computational technology, the dream of predicting the charge mobility is now gradually becoming a reality. This volume describes recent progresses in Prof. Shuai’s group in developing computational tools to assess the intrinsic carrier mobility for organic and carbon materials at the first-principles level. According to the electron-phonon coupling strength, the charge transport mechanism is classified into three different categories, namely, the localized hopping model, the extended band model, and the polaron model. For each of them, a corresponding theoretical approach is developed and implemented into typical examples.


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