Daniel Lu; C.P. Wong Materials for Advanced Packaging 9783319450971

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Автор: Daniel Lu; C.P. Wong
Название: Materials for Advanced Packaging
ISBN: 9783319450971
Издательство: Springer
Классификация:

Технологии производства металлов / металлургия

Другие технологии производства

Производство высокоточных приборов

Электроника

Схемы и компоненты

Электронные устройства и материалы

ISBN-10: 3319450972
Обложка/Формат: Hardback
Страницы: 969
Вес: 1.80 кг.
Дата издания: 2017
Серия: Engineering
Язык: English
Издание: 2nd ed. 2017
Иллюстрации: 434 tables, color; 85 tables, black and white; 440 illustrations, color; 260 illustrations, black and white; xvi, 969 p. 700 illus., 440 illus. in color.
Размер: 234 x 156 x 51
Читательская аудитория: Professional & vocational
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
Дополнительное описание: 3D Integration Technologies – An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Fabrication and Applications to W

Materials for Advanced Packaging, Daniel Lu; C.P. Wong