Описание: Contains the proceedings of the third Atomic Force Microscopy/Scanning Tunneling Microscopy symposium, which was held to provide an interface between scientists, engineers, representatives of industry, government, and academia, all of whom have a common interest in probe microscopies.
Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
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