Fusion bonding of polymer composites, Ageorges, C. Ye, L.

Автор: Mihai V. Putz
Название: Carbon Bonding and Structures
ISBN: 9400737041 ISBN-13(EAN): 9789400737044
Издательство: Springer
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Цена: 26120.00 р.
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Описание: This book reviews advances in modeling and characterization of both fundamental carbon based materials and newly designed carbon composites. Analyzes and interprets the physical and chemical patterns of carbon atoms in molecules, crystals and nanosystems.

Автор: Jan A. Dziuban
Название: Bonding in Microsystem Technology
ISBN: 9048171512 ISBN-13(EAN): 9789048171514
Издательство: Springer
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Цена: 26120.00 р.
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Описание: This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

Автор: Pierangelo Metrangolo; Giuseppe Resnati
Название: Halogen Bonding I
ISBN: 3319354981 ISBN-13(EAN): 9783319354989
Издательство: Springer
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Цена: 28732.00 р.
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Описание: LegonHalogen bonding in solution, Mate ErdelyiUnconventional motifs for halogen bonding, by Kari Rissanen Halogen bonding in supramolecular synthesis, Christer Aakeroy Halogen bond in synthetic organic chemistry, Stefan M.

Автор: L.H. Lee
Название: Adhesive Bonding
ISBN: 1475790082 ISBN-13(EAN): 9781475790085
Издательство: Springer
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Цена: 26122.00 р.
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Описание: For several years, I have been responsible for organizing and teaching in the fall a short course on "Fundamentals of Adhesion: Theory, Practice, and Applications" at the State University of New York at New Paltz.

Автор: Marin Alexe; Ulrich G?sele
Название: Wafer Bonding
ISBN: 3642059155 ISBN-13(EAN): 9783642059155
Издательство: Springer
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Цена: 32651.00 р.
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Описание: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.

Автор: J.M. Brown; P.B. Armentrout; P. Hofmann; D. Braga;
Название: Organometallic Bonding and Reactivity
ISBN: 3540642536 ISBN-13(EAN): 9783540642534
Издательство: Springer
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Цена: 40389.00 р.
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Описание: This volume addresses theoretical and experimental methodologies applicable to the structure and reactivity of organometallic compounds. The principles of ab initio and density functional theory, as well as integrated force field-quantum chemistry approaches are outlined.

Автор: Pierangelo Metrangolo; Giuseppe Resnati
Название: Halogen Bonding I
ISBN: 3319140566 ISBN-13(EAN): 9783319140568
Издательство: Springer
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Цена: 32652.00 р.
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Описание: LegonHalogen bonding in solution, Mate ErdelyiUnconventional motifs for halogen bonding, by Kari Rissanen Halogen bonding in supramolecular synthesis, Christer Aakeroy Halogen bond in synthetic organic chemistry, Stefan M.

Автор: Frank De Proft; Paul Geerlings
Название: Structure, Bonding and Reactivity of Heterocyclic Compounds
ISBN: 3642451489 ISBN-13(EAN): 9783642451485
Издательство: Springer
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Цена: 32652.00 р.
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Описание: The series Topics in Heterocyclic Chemistry presents critical reviews on present and future trends in the research of heterocyclic compounds. Overall the scope is to cover topics dealing with all areas within heterocyclic chemistry, both experimental and theoretical, of interest to the general heterocyclic chemistry community.

Автор: Pettifor, D.g.
Название: Bonding and structure of molecules and solids
ISBN: 0198517866 ISBN-13(EAN): 9780198517863
Издательство: Oxford Academ
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Цена: 8237.00 р.
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Описание: This volume explains the observed trends in the bonding and structure of molecules and solids within the framework of simple but predictive models that are based on the modern real-space approach to the electronic structure. It is directed at final year undergraduates and first year postgraduates in physics, chemistry, and materials science.

Автор: J.M. Brown; P.B. Armentrout; P. Hofmann; D. Braga;
Название: Organometallic Bonding and Reactivity
ISBN: 3662142236 ISBN-13(EAN): 9783662142233
Издательство: Springer
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Цена: 27950.00 р.
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Автор: L.H. Lee
Название: Adhesive Bonding
ISBN: 0306434717 ISBN-13(EAN): 9780306434716
Издательство: Springer
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Цена: 26122.00 р.
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Описание: For several years, I have been responsible for organizing and teaching in the fall a short course on "Fundamentals of Adhesion: Theory, Practice, and Applications" at the State University of New York at New Paltz.

Автор: Dillard David, Dillard D., Dillard Da
Название: Advances in Structural Adhesive Bonding
ISBN: 0081014465 ISBN-13(EAN): 9780081014462
Издательство: Elsevier Science
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Цена: 31160.00 р.
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Описание: Adhesive bonding is often effective, efficient, and often necessary way to join mechanical structures. This important book reviews the most recent improvements in adhesive bonding and their wide-ranging potential in structural engineering.Part one reviews advances in the most commonly used groups of structural adhesives with chapters covering topics such as epoxy, polyurethane, silicone, cyanoacrylate, and acrylic adhesives. The second set of chapters covers the various types of adherends and pre-treatment methods for a range of structural materials such as metals, composites and plastics. Chapters in Part three analyse methods and techniques with topics on joint design, life prediction, fracture mechanics and testing. The final group of chapters gives useful and practical insights into the problems and solutions of adhesive bonding in a variety of hostile environments such as chemical, wet and extreme temperatures.With its distinguished editor and international team of contributors, Advances in structural adhesive bonding is a standard reference for structural and chemical engineers in industry and the academic sector.