Wafer Bonding, Marin Alexe; Ulrich G?sele

Автор: J.H. Sadek
Название: Industrial Applications of Adhesive Bonding
ISBN: 9401080291 ISBN-13(EAN): 9789401080293
Издательство: Springer
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Цена: 14365.00 р.
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Описание: Recently, considerable research effort has been devoted to the fabrication of structures by adhesive bonding due to its definite advantages compared with other conventional techniques such as casting and welding.

Автор: D.M.P. Mingos; S. Fischer; D. Kurad; J. Mehmke; K.
Название: Bonding and Charge Distribution in Polyoxometalates: A Bond Valence Approach
ISBN: 3662156210 ISBN-13(EAN): 9783662156216
Издательство: Springer
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Цена: 16979.00 р.
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Описание: This book presents the most comprehensive analysis of bonding in polyoxometalates and related oxides based on classical bonding concepts and the bond valence model. Numerous tables and figures underline and illuminate the results, making it a valuable resource.

Автор: Pettifor, D.g.
Название: Bonding and structure of molecules and solids
ISBN: 0198517866 ISBN-13(EAN): 9780198517863
Издательство: Oxford Academ
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Цена: 8237.00 р.
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Описание: This volume explains the observed trends in the bonding and structure of molecules and solids within the framework of simple but predictive models that are based on the modern real-space approach to the electronic structure. It is directed at final year undergraduates and first year postgraduates in physics, chemistry, and materials science.

Автор: L.H. Lee
Название: Adhesive Bonding
ISBN: 1475790082 ISBN-13(EAN): 9781475790085
Издательство: Springer
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Цена: 26122.00 р.
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Описание: For several years, I have been responsible for organizing and teaching in the fall a short course on "Fundamentals of Adhesion: Theory, Practice, and Applications" at the State University of New York at New Paltz.

Автор: Ageorges, C. Ye, L.
Название: Fusion bonding of polymer composites
ISBN: 1447110870 ISBN-13(EAN): 9781447110873
Издательство: Springer
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Цена: 18167.00 р.
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Описание: Introduces a structured decision-making process that draws heavily from principle-based and positive ethics and provides practical applications of the APA Ethics Code while also accounting for federal laws and regulations. Detailed case examples illustrate how to apply this process in a variety of treatment contexts, including hospitals, long-term care facilities, and hospice care.

Автор: Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; M
Название: Copper Wire Bonding
ISBN: 1493953494 ISBN-13(EAN): 9781493953493
Издательство: Springer
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Цена: 14365.00 р.
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Описание: Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.