Copper Wire Bonding, Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; M

Автор: Marin Alexe; Ulrich G?sele
Название: Wafer Bonding
ISBN: 3642059155 ISBN-13(EAN): 9783642059155
Издательство: Springer
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Цена: 32651.00 р.
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Описание: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.

Автор: Thrall, E.w. Shannon, R.w.
Название: Adhesive bonding of aluminum alloys
ISBN: 0824774051 ISBN-13(EAN): 9780824774059
Издательство: Taylor&Francis
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Цена: 56654.00 р.
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Описание: This single-source reference is designed for anyone who is responsible for selecting the bestsurface treatment and a compatible adhesive for a particular design

Название: Handbook of Aluminum Bonding Technology and Data
ISBN: 0824788176 ISBN-13(EAN): 9780824788179
Издательство: Taylor&Francis
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Цена: 80388.00 р.
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Описание: A reference that offers comprehensive discussions on every important aspect of aluminum bonding for each level of manufacturing from mill finished to deoxidized, conversion coated, anodized, and painted surfaces and provides an extensive, up-to-date review of adhesion science, covering all significa

Автор: Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; M
Название: Copper Wire Bonding
ISBN: 1461457602 ISBN-13(EAN): 9781461457602
Издательство: Springer
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Цена: 16979.00 р.
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Описание: Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.

Автор: Jan A. Dziuban
Название: Bonding in Microsystem Technology
ISBN: 9048171512 ISBN-13(EAN): 9789048171514
Издательство: Springer
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Цена: 26120.00 р.
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Описание: This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

Автор: Ageorges, C. Ye, L.
Название: Fusion bonding of polymer composites
ISBN: 1447110870 ISBN-13(EAN): 9781447110873
Издательство: Springer
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Цена: 18167.00 р.
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Описание: Introduces a structured decision-making process that draws heavily from principle-based and positive ethics and provides practical applications of the APA Ethics Code while also accounting for federal laws and regulations. Detailed case examples illustrate how to apply this process in a variety of treatment contexts, including hospitals, long-term care facilities, and hospice care.

Автор: R. Saravanan; M. Prema Rani
Название: Metal and Alloy Bonding - An Experimental Analysis
ISBN: 1447161785 ISBN-13(EAN): 9781447161783
Издательство: Springer
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Цена: 13059.00 р.
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Описание: This volume elucidates the structural details of materials using the X-ray diffraction technique. Analyses of the charge density and the local and average structure are given to reveal the structural properties of technologically important materials.