Silicon Versus Carbon, Yuri Magarshak; Sergey Kozyrev; Ashok K. Vaseashta
Автор: Yuri Magarshak; Sergey Kozyrev; Ashok K. Vaseashta Название: Silicon Versus Carbon ISBN: 9048125227 ISBN-13(EAN): 9789048125227 Издательство: Springer Рейтинг: Цена: 21661.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Consists of a variety of invited contributions by experienced educators, scientists, and industrialists. This work covers important aspects of the field, from underlying principles to the most abstract concepts in nanotechnology. It is suitable for those pursuing or considering careers in the field of nanostructured materials and nanotechnology.
Автор: Wang Zhiming M Название: Silicon-based Nanomaterials ISBN: 1461481686 ISBN-13(EAN): 9781461481683 Издательство: Springer Рейтинг: Цена: 22203.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book address the practical issues associated with the development of nanomaterial-based devices in applications areas such as solar cells, luminous devices for optical communication, and high mobility transistors.
Автор: Lau John Название: Through-Silicon Vias for 3D Integration ISBN: 0071785140 ISBN-13(EAN): 9780071785143 Издательство: McGraw-Hill Рейтинг: Цена: 27626.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
Автор: Oda Название: Silicon Nanoelectronics ISBN: 0824726332 ISBN-13(EAN): 9780824726331 Издательство: Taylor&Francis Рейтинг: Цена: 33686.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Technological advancement in chip development, based on the downscaling of the feature size of transistors, is threatening to come to a standstill as we approach the limits of conventional scaling. This work takes a look at the development of novel devices and materials that hold great promise for the creation of still smaller and powerful chips.
Автор: Durrani, Zahid Ali Khan Название: Single-electron devices and circuits in silicon ISBN: 1848164130 ISBN-13(EAN): 9781848164130 Издательство: World Scientific Publishing Рейтинг: Цена: 17424.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provides a review of research on single-electron devices and circuits in silicon. This book focuses on the design, fabrication, and characterization of single-electron transistors, single-electron memory devices, few-electron transfer devices such as electron pumps and turnstiles, and single-electron logic devices.
Автор: E. Kasper; D.J. Paul Название: Silicon Quantum Integrated Circuits ISBN: 3642060382 ISBN-13(EAN): 9783642060380 Издательство: Springer Рейтинг: Цена: 30606.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Quantum size effects are becoming increasingly important in microelectronics, as the dimensions of the structures shrink laterally towards 100 nm and vertically towards 10 nm. Keeping in mind the trend towards systems on chip, this book deals with silicon-based quantum devices and focuses on room-temperature operation.
Автор: Petar R. Dvornic; Michael J Owen Название: Silicon-Containing Dendritic Polymers ISBN: 9048177928 ISBN-13(EAN): 9789048177929 Издательство: Springer Рейтинг: Цена: 26120.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This is the first book to solely focus on silicon-containing dendritic polymers. The contributions of those experts who originally introduced each field or played a major role in its progress are reported. Developments in all major areas are presented.
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.
The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.
Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
ООО "Логосфера " Тел:+7(495) 980-12-10 www.logobook.ru