Compact Models and Performance Investigations for Subthreshold Interconnects, Rohit Dhiman; Rajeevan Chandel

Автор: Todri-Sanial
Название: Carbon Nanotubes for Interconnects
ISBN: 3319297449 ISBN-13(EAN): 9783319297446
Издательство: Springer
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Цена: 16070.00 р.
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Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik
Название: Crosstalk in Modern On-Chip Interconnects
ISBN: 9811007993 ISBN-13(EAN): 9789811007996
Издательство: Springer
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Цена: 9141.00 р.
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Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.

Автор: Brajesh Kumar Kaushik; Manoj Kumar Majumder
Название: Carbon Nanotube Based VLSI Interconnects
ISBN: 8132220463 ISBN-13(EAN): 9788132220466
Издательство: Springer
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Цена: 8489.00 р.
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Описание: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.

Автор: Ethiopia Enideg Nigussie
Название: Variation Tolerant On-Chip Interconnects
ISBN: 1489990860 ISBN-13(EAN): 9781489990860
Издательство: Springer
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Цена: 18167.00 р.
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Описание: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. It is for anyone concerned with the design of next generation, high-performance electronics systems.

Автор: Tekin, Tolga
Название: Optical Interconnects for Data Centers
ISBN: 0081005121 ISBN-13(EAN): 9780081005125
Издательство: Elsevier Science
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Цена: 31686.00 р.
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Описание: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. . Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers.