More-than-Moore 2.5D and 3D SiP Integration, Riko Radojcic

Автор: D.F. Barbe
Название: Very Large Scale Integration (VLSI)
ISBN: 3642886426 ISBN-13(EAN): 9783642886423
Издательство: Springer
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Цена: 13974.00 р.
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Описание: With contributions by numerous experts

Автор: Darabi
Название: Integration of Passive RF Front End Components in SoCs
ISBN: 0521111269 ISBN-13(EAN): 9780521111263
Издательство: Cambridge Academ
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Цена: 14096.00 р.
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Описание: Examining key developments in highly integrated wireless RF front ends, this book describes problems with the use of surface acoustic wave (SAW) filters, evaluates alternative solutions for on-chip high-Q filtering, and presents M-phase filters in depth. This is core reading for practitioners and researchers in RF integrated circuit design.

Автор: Tom?? Vyhl?dal; Jean-Fran?ois Lafay; Rifat Sipahi
Название: Delay Systems
ISBN: 3319016946 ISBN-13(EAN): 9783319016948
Издательство: Springer
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Цена: 22203.00 р.
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Описание: Launching the series Advances in Dynamics and Delays, this book covers new ways of analyzing and controlling dynamical systems with delays, which arise in many real-world problems. Spans disciplines, encompassing engineering, physics, biology and economics.

Автор: Li
Название: SiP-System in Package Design and Simulation: Mento r Graphics Expedition Enterprise Flow Advanced Des ign Guide
ISBN: 1119045932 ISBN-13(EAN): 9781119045939
Издательство: Wiley
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Цена: 19158.00 р.
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Описание: An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow.

Автор: Garrou P
Название: Handbook of 3D Integration V 3
ISBN: 3527334661 ISBN-13(EAN): 9783527334667
Издательство: Wiley
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Цена: 22643.00 р.
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Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.

Автор: Garrou Philip
Название: Handbook of 3d Integration V1 and 2
ISBN: 3527332650 ISBN-13(EAN): 9783527332656
Издательство: Wiley
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Цена: 23118.00 р.
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Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.

Автор: Guo Qi Zhang; Alfred van Roosmalen
Название: More than Moore
ISBN: 1489984313 ISBN-13(EAN): 9781489984319
Издательство: Springer
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Цена: 26120.00 р.
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Описание: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore`s law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore`s law.

Автор: Rasit O. Topaloglu
Название: More than Moore Technologies for Next Generation Computer Design
ISBN: 1493921622 ISBN-13(EAN): 9781493921621
Издательство: Springer
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Цена: 15672.00 р.
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Описание: This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance.

Автор: Moshe Sipper; Daniel Mange; Andres Perez-Uribe
Название: Evolvable Systems: From Biology to Hardware
ISBN: 3540649549 ISBN-13(EAN): 9783540649540
Издательство: Springer
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Цена: 9083.00 р.
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Описание: These papers represent the proceedings of an international conference on evolvable systems, "From Biology to Hardware". They are organized into topical sections which cover areas such as evaluation of digital systems, evolution of analogue systems, embryonic electronics and bio-inspired systems.

Автор: Tom?? Vyhl?dal; Jean-Fran?ois Lafay; Rifat Sipahi
Название: Delay Systems
ISBN: 3319346857 ISBN-13(EAN): 9783319346854
Издательство: Springer
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Цена: 19589.00 р.
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Описание: Launching the series Advances in Dynamics and Delays, this book covers new ways of analyzing and controlling dynamical systems with delays, which arise in many real-world problems. Spans disciplines, encompassing engineering, physics, biology and economics.

Автор: Li
Название: System Design and Control Integration for Advanced Manufacturing
ISBN: 1118822269 ISBN-13(EAN): 9781118822265
Издательство: Wiley
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Цена: 12822.00 р.
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Описание: Most existing robust design books address design for static systems, or achieve robust design from experimental data via the Taguchi method. Little work considers model information for robust design particularly for the dynamic system.

Автор: Kazuo Kondo; Morihiro Kada; Kenji Takahashi
Название: Three-Dimensional Integration of Semiconductors
ISBN: 3319186744 ISBN-13(EAN): 9783319186740
Издательство: Springer
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Цена: 20896.00 р.
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Описание: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.