Testing of Interposer-Based 2.5D Integrated Circuits, Ran Wang; Krishnendu Chakrabarty

Автор: J. Altet; Antonio Rubio
Название: Thermal Testing of Integrated Circuits
ISBN: 144195287X ISBN-13(EAN): 9781441952875
Издательство: Springer
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Цена: 14673.00 р.
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Описание: Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Автор: Patrick DeWilde; Zhen-Qiu Ning
Название: Models for Large Integrated Circuits
ISBN: 1461288339 ISBN-13(EAN): 9781461288336
Издательство: Springer
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Цена: 21661.00 р.
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Описание: A modern microelectronic circuit can be compared to a large construction, a large city, on a very small area.

Автор: Swaminathan Madhavan
Название: Design and Modeling for 3D ICs and Interposers
ISBN: 9814508594 ISBN-13(EAN): 9789814508599
Издательство: World Scientific Publishing
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Цена: 16790.00 р.
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Описание: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Автор: Rafael Castro L?pez; Francisco V. Fern?ndez; ?scar
Название: Reuse-Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits
ISBN: 9048172896 ISBN-13(EAN): 9789048172894
Издательство: Springer
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Цена: 29209.00 р.
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Описание: This book presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow; The book features a detailed tutorial and in-depth coverage of all issues and must-have properties of reusable AMS blocks.

Автор: Yehea I. Ismail; Eby G. Friedman
Название: On-Chip Inductance in High Speed Integrated Circuits
ISBN: 1461356776 ISBN-13(EAN): 9781461356776
Издательство: Springer
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Цена: 13974.00 р.
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Описание: On-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.

Автор: Ingrid M.R. Verbauwhede
Название: Secure Integrated Circuits and Systems
ISBN: 1461425662 ISBN-13(EAN): 9781461425663
Издательство: Springer
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Цена: 19564.00 р.
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Описание: On any advanced integrated circuit or "system-on-chip" there is a need for security. The purpose of the book is to give the integrated circuits and systems designer an insight into the basics of security and cryptography from the implementation point of view.

Автор: Jean-Michel Redout?; Michiel Steyaert
Название: EMC of Analog Integrated Circuits
ISBN: 9400730888 ISBN-13(EAN): 9789400730885
Издательство: Springer
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Цена: 19589.00 р.
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Описание: This text details how to improve the electromagnetic immunity of considered analog integrated circuits. Through design cases, it explains how to identify and solve EMC problems in output stages, input stages and power supply terminals.

Автор: Henry Chang; Edoardo Charbon; Umakanta Choudhury;
Название: A Top-Down, Constraint-Driven Design Methodology for Analog Integrated Circuits
ISBN: 1461346800 ISBN-13(EAN): 9781461346807
Издательство: Springer
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Цена: 20962.00 р.
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Описание: Analog circuit design is often the bottleneck when designing mixed analog-digital systems. The principal goals are: (1) developing the design methodology, (2) developing and applying new tools, and (3) `proving` the methodology by undertaking `industrial strength` design examples.