Reliable Design of Electronic Equipment, Dhanasekharan Natarajan

Автор: Koichiro Ishibashi; Kenichi Osada
Название: Low Power and Reliable SRAM Memory Cell and Array Design
ISBN: 3642270182 ISBN-13(EAN): 9783642270185
Издательство: Springer
Рейтинг:
Цена: 15672.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The recent development of advanced semiconductor device technologies is due to the success of SRAM memory cells. This book addresses issues in the design of SRAM memory cells for advanced CMOS technology, including variability, leakage and reliability.

Автор: Trobaugh James
Название: Winning LEGO MINDSTORMS Programming: Rock-solid Reliable Pro
ISBN: 1430245360 ISBN-13(EAN): 9781430245360
Издательство: Springer
Рейтинг:
Цена: 3766.00 р.
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Описание: Winning LEGO MINDSTORMS Programming is your ticket to successfully programming for fun and competition with LEGO MINDSTORMS and the NXT-G programming language commonly used in FIRST LEGO League events.

Автор: Anup Kumar Das; Akash Kumar; Bharadwaj Veeravalli;
Название: Reliable and Energy Efficient Streaming Multiprocessor Systems
ISBN: 3319693735 ISBN-13(EAN): 9783319693736
Издательство: Springer
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Цена: 12157.00 р.
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Описание: This book discusses analysis, design and optimization techniques for streaming multiprocessor systems, while satisfying a given area, performance, and energy budget. The design flow described in this book extends to thermal and energy optimization with multiple applications running sequentially and concurrently.

Автор: Dhanasekharan Natarajan
Название: Reliable Design of Electronic Equipment
ISBN: 3319091107 ISBN-13(EAN): 9783319091105
Издательство: Springer
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Цена: 16769.00 р.
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Описание: This book explains reliability techniques with examples from electronics design for the benefit of engineers. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers.

Автор: Sung Kyu Lim
Название: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
ISBN: 1489986960 ISBN-13(EAN): 9781489986962
Издательство: Springer
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Цена: 16977.00 р.
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Описание: This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility.

Автор: Srinivasan Murali
Название: Designing Reliable and Efficient Networks on Chips
ISBN: 904818200X ISBN-13(EAN): 9789048182008
Издательство: Springer
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Цена: 19589.00 р.
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Описание: The book provides state-of-the-art methods to solve some of the most important problems encountered during NoC design. It is the first book to present in depth the state-of-the-art algorithms and optimization models for performing system-level design of NoCs.

Автор: Shafique, Muhammad Henkel, Jorg Rehman, Semeen
Название: Reliable software for unreliable hardware
ISBN: 3319257706 ISBN-13(EAN): 9783319257709
Издательство: Springer
Рейтинг:
Цена: 15672.00 р.
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Описание: Readers will learn how to achieve increased soft error resilience on unreliable hardware, while exploiting the inherent error masking characteristics and error (stemming from soft errors, aging, and process variations) mitigations potential at different software layers.

Автор: Gerald L. Ginsberg
Название: Electronic Equipment Packaging Technology
ISBN: 0442238185 ISBN-13(EAN): 9780442238186
Издательство: Springer
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Цена: 19591.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: As the electronics industry continues to pro- vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Автор: Ralph Remsburg
Название: Advanced Thermal Design of Electronic Equipment
ISBN: 1461346339 ISBN-13(EAN): 9781461346333
Издательство: Springer
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Цена: 19591.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: The field of electronic packaging continues to grow at an amazing rate. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future.