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Advances in Rapid Thermal and Integrated Processing, F. Roozeboom


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Автор: F. Roozeboom
Название:  Advances in Rapid Thermal and Integrated Processing
ISBN: 9780792340119
Издательство: Springer
Классификация:


ISBN-10: 0792340116
Обложка/Формат: Hardcover
Страницы: 566
Вес: 1.02 кг.
Дата издания: 31.03.1996
Серия: Nato Science Series E:
Язык: English
Размер: 237 x 161 x 42
Основная тема: Physics
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level.


Rapid Thermal Processing of Semiconductors

Автор: Victor E. Borisenko; Peter J. Hesketh
Название: Rapid Thermal Processing of Semiconductors
ISBN: 148991806X ISBN-13(EAN): 9781489918062
Издательство: Springer
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Цена: 30745.00 р.
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Описание: Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions.

Integrated Circuits for Analog Signal Processing

Автор: Esteban Tlelo-Cuautle
Название: Integrated Circuits for Analog Signal Processing
ISBN: 1489994572 ISBN-13(EAN): 9781489994578
Издательство: Springer
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Цена: 18284.00 р.
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Описание: This book presents the theory, design methodology and fresh applications of integrated circuits for analog signal processing. It covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode.

Advances in Communications and Signal Processing

Автор: William A. Porter; Subhash C. Kak
Название: Advances in Communications and Signal Processing
ISBN: 3540514244 ISBN-13(EAN): 9783540514244
Издательство: Springer
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Цена: 12157.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This international conference on "Advances in Communications and Control Systems" was held to bring together researchers in communications, control systems, computing and signal processing to explore common themes and present research results of broad interest.

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Автор: Dean L. Monthei
Название: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
ISBN: 1461373255 ISBN-13(EAN): 9781461373254
Издательство: Springer
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Цена: 23757.00 р.
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Описание: Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

Thermal Testing of Integrated Circuits

Автор: J. Altet; Antonio Rubio
Название: Thermal Testing of Integrated Circuits
ISBN: 144195287X ISBN-13(EAN): 9781441952875
Издательство: Springer
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Цена: 14673.00 р.
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Описание: Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Rapid Thermal Processing of Semiconductors

Автор: Victor E. Borisenko; Peter J. Hesketh
Название: Rapid Thermal Processing of Semiconductors
ISBN: 0306450542 ISBN-13(EAN): 9780306450549
Издательство: Springer
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Цена: 28734.00 р.
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Описание: Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions.

Advances in Microwave and Radio Frequency Processing

Автор: M. Willert-Porada
Название: Advances in Microwave and Radio Frequency Processing
ISBN: 3642077552 ISBN-13(EAN): 9783642077555
Издательство: Springer
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Цена: 45712.00 р.
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Описание: Prometheus brought fire to mankind Arthur R. von Hippel "Dielectrics and Waves," 1954 Our contribution? There are only few areas of research and development of a comparable scientific and technological extension as microwave and high frequency processing. "Pr- essing" means not only application of radiation of 300 MHz to 300 GHz f- quency to synthesis, heating or ionisation of matter but also generation, transm- sion and detection of microwave and radio frequency radiation. Microwave and high frequency sources positioned in the orbit are the foun- tion of modern satellite telecommunication systems, gyrotron tubes being pr- ently developed in different countries all over the world will most probably be the major devices to open up a new era of energy supply to mankind be means of - sion plasma. Although initiated by military purposes during the Second World War (RADAR, Radio Detection and Ranging), microwave and high frequency utilisation has spread over almost every important aspect of normal day life since than, from individual mobile phones and kitchen microwave ovens to industrial food processing, production of composites as sustainable building materials, green chemistry, medical applications and finally infrastructure installations like GPS and Galileo, to name only few examples. These different areas of microwave and high frequency radiation application can not be unified within one group of scientists and technologists. There are s- eral distinguished communities active e.g., in the area of telecommunication s- tems, strong microwaves for fusion plasma or plasma based materials processing.

Reduced Thermal Processing for ULSI

Автор: R.A. Levy
Название: Reduced Thermal Processing for ULSI
ISBN: 1461278570 ISBN-13(EAN): 9781461278573
Издательство: Springer
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Цена: 12157.00 р.
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Описание: Proceedings of a NATO ASI held in Boca Raton, Florida, June 20-July 1, 1988

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Автор: Dean L. Monthei
Название: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
ISBN: 0792383648 ISBN-13(EAN): 9780792383642
Издательство: Springer
Рейтинг:
Цена: 23757.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.


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