The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, Gerard Kelly

Автор: X.J. Fan; E. Suhir
Название: Moisture Sensitivity of Plastic Packages of IC Devices
ISBN: 1461426251 ISBN-13(EAN): 9781461426257
Издательство: Springer
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Цена: 34937.00 р.
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Описание: This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.

Автор: P. Singh; Puligandla Viswanadham
Название: Failure Modes and Mechanisms in Electronic Packages
ISBN: 1461377633 ISBN-13(EAN): 9781461377634
Издательство: Springer
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Цена: 26122.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.