Moisture Sensitivity of Plastic Packages of IC Devices, X.J. Fan; E. Suhir

Автор: Jos? Pineda de Gyvez
Название: Integrated Circuit Defect-Sensitivity: Theory and Computational Models
ISBN: 0792393066 ISBN-13(EAN): 9780792393061
Издательство: Springer
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Цена: 18167.00 р.
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Описание: Spot defects are random phenomena present in every fabrication line. As technological processes mature towards submicron features, the effect of these defects on the functional and parametric behavior of the IC becomes crucial. This title reviews the importance of a defect-sensitivity analysis in contemporary VLSI design procedures.

Автор: Grosz
Название: High Sensitivity Magnetometers
ISBN: 3319340689 ISBN-13(EAN): 9783319340685
Издательство: Springer
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Цена: 25155.00 р.
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Описание: This book gathers, for the first time, an overview of nearly all of the magnetic sensors that exist today. The book is offering the readers a thorough and comprehensive knowledge from basics to state-of-the-art and is therefore suitable for both beginners and experts. From the more common and popular AMR magnetometers and up to the recently developed NV center magnetometers, each chapter is describing a specific type of sensor and providing all the information that is necessary to understand the magnetometer behavior including theoretical background, noise model, materials, electronics, design and fabrication techniques, etc.

Автор: P. Singh; Puligandla Viswanadham
Название: Failure Modes and Mechanisms in Electronic Packages
ISBN: 1461377633 ISBN-13(EAN): 9781461377634
Издательство: Springer
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Цена: 26122.00 р.
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Описание: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Автор: A. L. Dontchev
Название: Perturbations, Approximations and Sensitivity Analysis of Optimal Control Systems
ISBN: 3540124632 ISBN-13(EAN): 9783540124634
Издательство: Springer
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Цена: 12157.00 р.
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Автор: Gerard Kelly
Название: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
ISBN: 0792384857 ISBN-13(EAN): 9780792384854
Издательство: Springer
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Цена: 20896.00 р.
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Описание: Deals with understanding the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. This book emphasises on the correct use of finite element tools for these problems.