Radio-Frequency Microelectronic Circuits for Telecommunication Applications, Yannis E. Papananos
Автор: J. T. Milek Название: Silicon Nitride for Microelectronic Applications ISBN: 1461596114 ISBN-13(EAN): 9781461596110 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.
Автор: Suresh Chandra Satapathy; N Bheema Rao; S Srinivas Название: Microelectronics, Electromagnetics and Telecommunications ISBN: 8132227263 ISBN-13(EAN): 9788132227267 Издательство: Springer Рейтинг: Цена: 43100.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This volume contains 73 papers presented at ICMEET 2015:International Conference on Microelectronics, Electromagnetics andTelecommunications. The conference was held during 18 - 19 December, 2015 atDepartment of Electronics and Communication Engineering, GITAM Institute ofTechnology, GITAM University, Visakhapatnam, INDIA.
Автор: J?rg Schwizer; Michael Mayer; Oliver Brand Название: Force Sensors for Microelectronic Packaging Applications ISBN: 3642060633 ISBN-13(EAN): 9783642060632 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Автор: R.A. Levy Название: Microelectronic Materials and Processes ISBN: 0792301471 ISBN-13(EAN): 9780792301479 Издательство: Springer Рейтинг: Цена: 73791.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986
Описание: This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in high technology engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc- tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc- tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi- ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
Автор: R.A. Levy Название: Microelectronic Materials and Processes ISBN: 0792301544 ISBN-13(EAN): 9780792301547 Издательство: Springer Рейтинг: Цена: 48774.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986
Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
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