Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication, Jianfeng Luo; David A. Dornfeld
Автор: Khandpur Название: Printed circuit boards; design, fabrication and assembly ISBN: 0071464204 ISBN-13(EAN): 9780071464208 Издательство: McGraw-Hill Рейтинг: Цена: 21277.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: A comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication. It covers the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.
Автор: Charles Harper Название: Electronic Assembly Fabrication ISBN: 0071378820 ISBN-13(EAN): 9780071378826 Издательство: McGraw-Hill Рейтинг: Цена: 8856.00 р. Наличие на складе: Поставка под заказ.
Описание:
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YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS
Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:
ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.
Описание: This book presents a universal mass-production micro/nano integrated fabrication technology, which can be used to realize micro/nano hierarchical structures on Si-based materials and flexible polymeric materials.
Автор: Fan Mo; Robert K. Brayton Название: Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design ISBN: 1475779348 ISBN-13(EAN): 9781475779349 Издательство: Springer Рейтинг: Цена: 13974.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design discusses new approaches to better timing-closure and manufacturability of DSM Integrated Circuits. A timing-driven chip design flow is developed based on the new structures and their design algorithms, which produces faster chips in a shorter time.
Автор: Ekkard Brinksmeier; Oltmann Riemer; Ralf M. Gl?be Название: Fabrication of Complex Optical Components ISBN: 3642430325 ISBN-13(EAN): 9783642430329 Издательство: Springer Рейтинг: Цена: 23508.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explores the current state of the processing steps called a `process chain,` covering all steps from mold design, advanced machining and coating of molds, to the replication and final precision measurement of the quality of the optical components.
Автор: M.R. Oliver Название: Chemical-Mechanical Planarization of Semiconductor Materials ISBN: 3642077382 ISBN-13(EAN): 9783642077388 Издательство: Springer Рейтинг: Цена: 28732.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Автор: Suryadevara Babu Название: Advances in Chemical Mechanical Planarization (CMP) ISBN: 0081001657 ISBN-13(EAN): 9780081001653 Издательство: Elsevier Science Рейтинг: Цена: 35202.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. . This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. . Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.
