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Handbook of Electronic Materials, M. Neuberger


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Автор: M. Neuberger
Название:  Handbook of Electronic Materials
ISBN: 9781468479195
Издательство: Springer
Классификация:


ISBN-10: 1468479199
Обложка/Формат: Paperback
Страницы: 68
Вес: 0.19 кг.
Дата издания: 11.12.2012
Язык: English
Размер: 279 x 210 x 4
Основная тема: Materials Science
Подзаголовок: Volume 5: Group IV Semiconducting Materials
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: v CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Germanium . . . . . 14 Bibliography . 28 Silicon . 36 Bibliography .


Theory of Charge Transport in Carbon Electronic Materials

Автор: Shuai
Название: Theory of Charge Transport in Carbon Electronic Materials
ISBN: 3642250750 ISBN-13(EAN): 9783642250750
Издательство: Springer
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Цена: 7182.00 р.
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Описание: Mechanism of charge transport in organic solids has been an issue of intensive interests and debates for over 50 years, not only because of the applications in printing electronics, but also because of the great challenges in understanding the electronic processes in complex systems. With the fast developments of both electronic structure theory and the computational technology, the dream of predicting the charge mobility is now gradually becoming a reality. This volume describes recent progresses in Prof. Shuai’s group in developing computational tools to assess the intrinsic carrier mobility for organic and carbon materials at the first-principles level. According to the electron-phonon coupling strength, the charge transport mechanism is classified into three different categories, namely, the localized hopping model, the extended band model, and the polaron model. For each of them, a corresponding theoretical approach is developed and implemented into typical examples.

Nanotechnology for Electronic Materials and Devices

Автор: Anatoli Korkin; Evgeni Gusev; Jan K. Labanowski; S
Название: Nanotechnology for Electronic Materials and Devices
ISBN: 1441936122 ISBN-13(EAN): 9781441936127
Издательство: Springer
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Цена: 23508.00 р.
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Описание: The high level of attention and interest of the global community to NANO science and technology to a large extent is linked to the GIGAntic challenges for the c- tinuing growth of information technology, which sparked an unprecedented level of interdisciplinary and international cooperation among industrial and academic researchers, companies, IT market rivals, and countries, including former political and military rivals . Microelectronics technologies have reached a new stage in their development: The latest miniaturization of electronic devices is approaching atomic dimensions, interconnect bottlenecks are limiting circuit speeds, new ma- rials are being introduced into microelectronics manufacture at an unprecedented rate, and alternative technologies to mainstream complementary metal-oxide sem- conductors (CMOSs) are being considered . The very dynamic stage of science and technology related to the advanced and future electronics and photonics creates a growing gap between the large number of rapid publications and nanotechnology highlights in media on one side and fundamental understanding of underlying phenomena and an adequate evaluation of scientific discoveries and technological innovations on the other side. Writing a tutorial book on fundamentals of science and technology for electronics at this time is almost the same level of challenge as writing a history book during a revolution.

The Physics of Opto-Electronic Materials

Автор: Walter Albers
Название: The Physics of Opto-Electronic Materials
ISBN: 1468419498 ISBN-13(EAN): 9781468419498
Издательство: Springer
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Цена: 6986.00 р.
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Описание: Unlike the single-crystal electrooptic effects which are quite suitable for modulation of coherent laser light, these latter materials promise relatively inexpensive approaches to the modulation of light from ordinary incoherent light sources.

Springer Handbook of Electronic and Photonic Materials

Автор: Kasap
Название: Springer Handbook of Electronic and Photonic Materials
ISBN: 0387260595 ISBN-13(EAN): 9780387260594
Издательство: Springer
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Цена: 34799.00 р.
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Описание: Covers a range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. This handbook starts at a senior-undergraduate level and builds up the subject matter in easy steps. It is useful reference for electrical engineers, materials scientists and physicists.

Handbook of Electronic Materials

Автор: A. Moses
Название: Handbook of Electronic Materials
ISBN: 1468461613 ISBN-13(EAN): 9781468461619
Издательство: Springer
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Цена: 6986.00 р.
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Описание: The Electronic Properties Information Center (EPIC) is a designated Information Analysis Center of the Department of Defense authorized to provide information to the entire DOD community.

Springer Handbook of Electronic and Photonic Materials

Автор: Safa Kasap; Peter Capper
Название: Springer Handbook of Electronic and Photonic Materials
ISBN: 3319489313 ISBN-13(EAN): 9783319489315
Издательство: Springer
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Цена: 38992.00 р.
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Описание: The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications.

Electromigration in Thin Films and Electronic Devices: Materials and Reliability

Автор: Kim Choong-Un
Название: Electromigration in Thin Films and Electronic Devices: Materials and Reliability
ISBN: 0081016964 ISBN-13(EAN): 9780081016961
Издательство: Elsevier Science
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Цена: 28739.00 р.
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Описание: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field.

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Автор: Licari James J., Swanson Dale W.
Название: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
ISBN: 0128103701 ISBN-13(EAN): 9780128103708
Издательство: Elsevier Science
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Цена: 23244.00 р.
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Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Electronic Properties of Composite Materials

Автор: M. A. Leeds
Название: Electronic Properties of Composite Materials
ISBN: 1461596149 ISBN-13(EAN): 9781461596141
Издательство: Springer
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Цена: 6986.00 р.
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Описание: The specific properties tabulated are: Arc Resistance Thermal Conductivity Arc Tracking Resistance Linear Thermal Expansion Dielectric Constant Coefficient Dissipation Factor Electrical (Volume) Resistivity Electrical (Volume) Conductivity Other electrical and thermal properties are compiled as the data was made available.

Wide Band Gap Electronic Materials

Автор: Mark A. Prelas; Peter Gielisse; Galina Popovici; B
Название: Wide Band Gap Electronic Materials
ISBN: 0792334051 ISBN-13(EAN): 9780792334057
Издательство: Springer
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Цена: 49613.00 р.
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Описание: The topics covered by this work include electronic doping of diamond, n-type diamond, negative electron affinity of diamond, applications of aluminum nitride, the doping of boron nitride, wide-band gap electronic applications, and nanophase diamond.


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