Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Автор: YongAn Huang; Zhouping Yin; Xiaodong Wan Название: Modeling and Application of Flexible Electronics Packaging ISBN: 9811336261 ISBN-13(EAN): 9789811336263 Издательство: Springer Рейтинг: Цена: 20962.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Автор: Bernard S. Matisoff Название: Handbook Of Electronics Packaging Design and Engineering ISBN: 9401169810 ISBN-13(EAN): 9789401169813 Издательство: Springer Рейтинг: Цена: 6986.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design.
Автор: Daniel Lu; C.P. Wong Название: Materials for Advanced Packaging ISBN: 3319832093 ISBN-13(EAN): 9783319832098 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.
Описание: Explains the interactions between the device-under-test (DUT) and the measuring equipment by demonstrating the best practices for ascertaining the true nature of the DUT, and optimizing the time to set up and measure
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