Автор: Chandra Mouli Pandey, Bansi Dhar Malhotra Название: Biosensors: Fundamentals and Applications ISBN: 3110637804 ISBN-13(EAN): 9783110637809 Издательство: Walter de Gruyter Цена: 35161.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on the state-of-the-art of biosensor research and development for specialists and non-specialists. It introduces the fundamentals of the subject with relevant characteristics of transducer elements, as well as biochemical recognition molecules. This book is ideal for researchers of nanotechnology, materials science and biophysics.
Автор: Lall, Pradeep , Pecht, Michael G. , Hakim, Edwar Название: Influence of Temperature on Microelectronics and System Reliability ISBN: 0367400979 ISBN-13(EAN): 9780367400972 Издательство: Taylor&Francis Рейтинг: Цена: 9186.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures.
Автор: John Lau Название: Thermal Stress and Strain in Microelectronics Packaging ISBN: 1468477692 ISBN-13(EAN): 9781468477696 Издательство: Springer Рейтинг: Цена: 16979.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.
Автор: Kenji Uchino Название: MicroMechatronics, Second Edition ISBN: 036720231X ISBN-13(EAN): 9780367202316 Издательство: Taylor&Francis Рейтинг: Цена: 22202.00 р. Наличие на складе: Поставка под заказ.
Описание: Uchino presents in this updated Second Edition, a theoretical description of solid-state actuators, an overview of practical materials, device designs, drive/control techniques, and typical applications, as we consider current and future trends in the field of micromechatronics.
Описание: Computational Electrodynamics is a vast research field with a wide variety of tools. In physics the principle of gauge invariance plays a pivotal role as a guide towards a sensible formulation of the laws of nature as well as computing the properties of elementary particles using the lattice formulation of gauge theories, yet the gauge principle has played a much less pronounced role in performing computation in classical electrodynamics. In this work the author will demonstrate that starting from the gauge formulation of electrodynamics using the electromagnetic potentials leads to computational tools that can very well compete with the conventional electromagnetic field-based tools. Once accepting the formulation based on gauge fields, the computational code is very transparent due to the mimetic mapping of the electrodynamic variables on the computational grid. Although the illustrations and applications originate from microelectronic engineering, the method has a much larger range of applicability. Therefore this book is of interest to everyone having interest in computational electrodynamics. The volume is organized as follows: In part 1, a detailed introduction and overview is presented of the Maxwell equations as well as the derivation of the current and charge densities is different materials. Semiconductors are responding to electromagnetic fields in a non-linear way and the induced complications are discussed in detail. In part 2, the transition of the theory of electrodynamics, using the gauge potentials, to a formulation that can serve as the gateway to computational code is presented. In part 3, the feasibility and success of the methods of part 2 are demonstrated by a collection of microelectronic device designs. Part 4 focuses on a set of topical themes that brings the reader to the frontier of research in building the simulation tools using the gauge principle in computational electrodynamics.Technical topics discussed in the book include:Electromagnetic Field EquationsConstitutive RelationsDiscretization and Numerical AnalysisFinite Element and Finite Volume MethodsDesign of Integrated Passive Components.
Автор: Daniel Lu; C.P. Wong Название: Materials for Advanced Packaging ISBN: 3319832093 ISBN-13(EAN): 9783319832098 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.
In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.
Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies.
Featuring contributions by academic and industrial researchers from around the world, this book:
Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS)
Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images
Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more
Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems
Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.
Название: Nanoelectronic Device Applications Handbook ISBN: 1138072591 ISBN-13(EAN): 9781138072596 Издательство: Taylor&Francis Рейтинг: Цена: 16078.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal-oxide-semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe.
The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include:
Nanoscale advances in current MOSFET/CMOS technology
Nano capacitors for applications such as electronics packaging and humidity sensors
Single electron transistors and other electron tunneling devices
Quantum cellular automata and nanomagnetic logic
Memristors as switching devices and for memory
Graphene preparation, properties, and devices
Carbon nanotubes (CNTs), both single CNT and random network
Other CNT applications such as terahertz, sensors, interconnects, and capacitors
Nano system architectures for reliability
Nanowire device fabrication and applications
Nanowire transistors
Nanodevices for spintronics
The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries.
This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.
Автор: Jan Korvink; Oliver Paul Название: MEMS: A Practical Guide of Design, Analysis, and Applications ISBN: 3662568357 ISBN-13(EAN): 9783662568354 Издательство: Springer Рейтинг: Цена: 27950.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: A new generation of MEMS books has emerged with this cohesive guide on the design and analysis of micro-electro-mechanical systems (MEMS). Satisfying a demand for literature on analysis and design of microsystems the book deals with a broad array of industrial applications.
Автор: Steer Michael Название: Microwave and RF Design, Volume 1: Radio Systems ISBN: 1469656906 ISBN-13(EAN): 9781469656908 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 2006.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microwave and RF Design: Radio Systems is a circuits- and systems-oriented approach to modern microwave and RF systems. Sufficient details at the circuits and sub-system levels are provided to understand how modern radios are implemented. Design is emphasized throughout. The evolution of radio from what is now known as 0G, for early radio, through to 6G, for sixth generation cellular radio, is used to present modern microwave and RF engineering concepts. Two key themes unify the text: 1) how system-level decisions affect component, circuit and subsystem design; and 2) how the capabilities of technologies, components, and subsystems impact system design. This book is suitable as both an undergraduate and graduate textbook, as well as a career-long reference book.
Key Features * The first volume of a comprehensive series on microwave and RF design * Open access ebook editions are hosted by NC State University Libraries at https: //repository.lib.ncsu.edu/handle/1840.20/36776 * 31 worked examples * An average of 38 exercises per chapter * Answers to selected exercises * Coverage of cellular radio from 1G through 6G * Case study of a software defined radio illustrating how modern radios partition functionality between analog and digital domains * A companion book, Fundamentals of Microwave and RF Design, is suitable as a comprehensive undergraduate textbook on microwave engineering
Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf Название: Microelectronics Packaging Handbook ISBN: 0412084511 ISBN-13(EAN): 9780412084515 Издательство: Springer Рейтинг: Цена: 27251.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
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